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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20251102T070000
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DTSTART:20250603T150000Z
DTEND:20250603T160000Z
DTSTAMP:20260419T150333
CREATED:20250514T180756Z
LAST-MODIFIED:20250514T180756Z
UID:32483-1748944800-1748948400@hdpusergroup.org
SUMMARY:Stacked vs. Staggered Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-vs-staggered-microvias-3/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250603T160000Z
DTEND:20250603T170000Z
DTSTAMP:20260419T150333
CREATED:20250513T141913Z
LAST-MODIFIED:20250513T141913Z
UID:30374-1748948400-1748952000@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project Kickoff
DESCRIPTION:Explore New Project on Thin Dielectric Weave Skew 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-kickoff-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250603T170000Z
DTEND:20250603T180000Z
DTSTAMP:20260419T150333
CREATED:20250512T155608Z
LAST-MODIFIED:20250512T155608Z
UID:30290-1748952000-1748955600@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-9/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250604T140000Z
DTEND:20250604T150000Z
DTSTAMP:20260419T150333
CREATED:20250602T141346Z
LAST-MODIFIED:20250602T141346Z
UID:30268-1749027600-1749031200@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-19/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250604T150000Z
DTEND:20250604T160000Z
DTSTAMP:20260419T150333
CREATED:20250423T155004Z
LAST-MODIFIED:20250423T155004Z
UID:30202-1749031200-1749034800@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing Phase 2
DESCRIPTION:Inner Layer Copper Balancing Phase 2 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-phase-2-6/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250605T000000Z
DTEND:20250605T010000Z
DTSTAMP:20260419T150333
CREATED:20250604T075338Z
LAST-MODIFIED:20250604T075338Z
UID:30271-1749063600-1749067200@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-adhesion-project-call/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250605T150000Z
DTEND:20250605T160000Z
DTSTAMP:20260419T150333
CREATED:20250508T151737Z
LAST-MODIFIED:20250508T151737Z
UID:30277-1749117600-1749121200@hdpusergroup.org
SUMMARY:What is Good Enough Microvia Reliability?
DESCRIPTION:Project Call to gauge members interest in this proposed project. 
URL:https://hdpusergroup.org/event/what-is-good-enough-microvia-reliability/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250605T170000Z
DTEND:20250605T180000Z
DTSTAMP:20260419T150333
CREATED:20250529T125512Z
LAST-MODIFIED:20250529T125512Z
UID:35863-1749124800-1749128400@hdpusergroup.org
SUMMARY:Investigate Electrical Performance of Stacked vs. Staggered Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/investigate-electrical-performance-of-stacked-vs-staggered-microvias-4/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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