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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20251102T070000
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DTSTART:20250331T150000Z
DTEND:20250331T160000Z
DTSTAMP:20260419T150647
CREATED:20250310T155911Z
LAST-MODIFIED:20250310T155911Z
UID:29518-1743415200-1743418800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-61/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20250401T170000Z
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DTSTAMP:20260419T150647
CREATED:20250311T150101Z
LAST-MODIFIED:20250311T150101Z
UID:29519-1743508800-1743512400@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-7/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250402T140000Z
DTEND:20250402T150000Z
DTSTAMP:20260419T150647
CREATED:20250205T151618Z
LAST-MODIFIED:20250205T151618Z
UID:29164-1743584400-1743588000@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-16/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20250402T150000Z
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CREATED:20250320T153051Z
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UID:29559-1743588000-1743591600@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-8/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250403T000000Z
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DTSTAMP:20260419T150647
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UID:29675-1743620400-1743624000@hdpusergroup.org
SUMMARY:Call with Ed Kelly
DESCRIPTION:Call with Ed Kelly 
URL:https://hdpusergroup.org/event/call-with-ed-kelly/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250403T010000Z
DTEND:20250403T020000Z
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CREATED:20250313T013141Z
LAST-MODIFIED:20250313T013141Z
UID:29532-1743624000-1743627600@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-16/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20250403T160000Z
DTEND:20250403T170000Z
DTSTAMP:20260419T150647
CREATED:20250205T172746Z
LAST-MODIFIED:20250205T172746Z
UID:29171-1743678000-1743681600@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-18/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250403T210000Z
DTEND:20250403T220000Z
DTSTAMP:20260419T150647
CREATED:20250313T220829Z
LAST-MODIFIED:20250313T220829Z
UID:29542-1743696000-1743699600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-14/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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