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X-WR-CALDESC:Events for HDP User Group
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TZOFFSETFROM:-0600
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DTSTART:20250309T080000
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DTSTART:20251102T070000
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DTSTART:20250121T150000Z
DTEND:20250121T160000Z
DTSTAMP:20260420T054849
CREATED:20250113T163637Z
LAST-MODIFIED:20250113T163637Z
UID:28778-1737450000-1737453600@hdpusergroup.org
SUMMARY:TCE Materials
DESCRIPTION:Project idea Stage. \nInvestigate TCE (CTE) of materials in the x-y as well as in the Z axis. \nDoes differeent CTEs in the x-y impact solder joint reliability. \n  
URL:https://hdpusergroup.org/event/tce-materials/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250122T160000Z
DTEND:20250122T170000Z
DTSTAMP:20260420T054849
CREATED:20241219T152638Z
LAST-MODIFIED:20241219T152638Z
UID:28612-1737540000-1737543600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-38/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250122T210000Z
DTEND:20250122T220000Z
DTSTAMP:20260420T054849
CREATED:20250108T215334Z
LAST-MODIFIED:20250108T215334Z
UID:28687-1737558000-1737561600@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Final details \nBoD draft presentation 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-10/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20250123T010000Z
DTEND:20250123T020000Z
DTSTAMP:20260420T054849
CREATED:20241226T011942Z
LAST-MODIFIED:20241226T011942Z
UID:28625-1737572400-1737576000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-13/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250123T170000Z
DTEND:20250123T180000Z
DTSTAMP:20260420T054849
CREATED:20250107T203511Z
LAST-MODIFIED:20250107T203511Z
UID:28650-1737630000-1737633600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-35/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20250123T220000Z
DTEND:20250123T230000Z
DTSTAMP:20260420T054849
CREATED:20250109T225530Z
LAST-MODIFIED:20250109T225530Z
UID:28739-1737648000-1737651600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-11/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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