BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20241202T210000Z
DTEND:20241202T220000Z
DTSTAMP:20260420T014206
CREATED:20241202T191306Z
LAST-MODIFIED:20241202T191306Z
UID:28552-1733151600-1733155200@hdpusergroup.org
SUMMARY:meeting with Bev
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/meeting-with-bev/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241204T160000Z
DTEND:20241204T170000Z
DTSTAMP:20260420T014206
CREATED:20241113T162821Z
LAST-MODIFIED:20241113T162821Z
UID:28390-1733306400-1733310000@hdpusergroup.org
SUMMARY:Single Surface Finish 2
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-2/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241204T170000Z
DTEND:20241204T180000Z
DTSTAMP:20260420T014206
CREATED:20241030T163629Z
LAST-MODIFIED:20241030T163629Z
UID:28283-1733310000-1733313600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing - Phase 2
DESCRIPTION:I/L Cu Balancing - Phase 2 project meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-phase-2-2/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241204T210000Z
DTEND:20241204T220000Z
DTSTAMP:20260420T014206
CREATED:20241030T203621Z
LAST-MODIFIED:20241030T203621Z
UID:28285-1733324400-1733328000@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Talk about design\, fab\, # of samples\, material type(s) 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-8/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241205T150000Z
DTEND:20241205T160000Z
DTSTAMP:20260420T014206
CREATED:20241114T153743Z
LAST-MODIFIED:20241114T153743Z
UID:28393-1733389200-1733392800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-33/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241206T150000Z
DTEND:20241206T160000Z
DTSTAMP:20260420T014206
CREATED:20241202T201324Z
LAST-MODIFIED:20241202T201324Z
UID:28554-1733475600-1733479200@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Discussion with Dr. Fan and use of Huray Model for validation 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-16/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR