BEGIN:VCALENDAR
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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
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BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
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BEGIN:VEVENT
DTSTART:20241028T150000Z
DTEND:20241028T160000Z
DTSTAMP:20260419T185315
CREATED:20241007T160601Z
LAST-MODIFIED:20241007T160601Z
UID:28087-1730109600-1730113200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-53/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241030T150000Z
DTEND:20241030T160000Z
DTSTAMP:20260419T185315
CREATED:20241002T155218Z
LAST-MODIFIED:20241002T155218Z
UID:28070-1730282400-1730286000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-25/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241030T160000Z
DTEND:20241030T170000Z
DTSTAMP:20260419T185315
CREATED:20241015T152049Z
LAST-MODIFIED:20241015T152049Z
UID:28170-1730286000-1730289600@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing – Phase 2
DESCRIPTION:Inner Layer Cu Balancing – Phase 2 project meeting 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-phase-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20241030T200000Z
DTEND:20241030T210000Z
DTSTAMP:20260419T185315
CREATED:20241002T190549Z
LAST-MODIFIED:20241002T190549Z
UID:27764-1730300400-1730304000@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Hopefully had both a CAD source and PCB manufacturer onboard before the meeting or by the end of the meeting. 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-7/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241031T140000Z
DTEND:20241031T150000Z
DTSTAMP:20260419T185315
CREATED:20241003T152645Z
LAST-MODIFIED:20241003T152645Z
UID:28083-1730365200-1730368800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-31/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20241031T230000Z
DTEND:20241101T000000Z
DTSTAMP:20260419T185315
CREATED:20241003T234820Z
LAST-MODIFIED:20241003T234820Z
UID:28084-1730397600-1730401200@hdpusergroup.org
SUMMARY:Porosity Testing
DESCRIPTION:Where are we on pilot runs 
URL:https://hdpusergroup.org/event/porosity-testing-3/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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END:VCALENDAR