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X-WR-CALDESC:Events for HDP User Group
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TZOFFSETFROM:-0600
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DTSTART:20240310T080000
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DTSTART:20241103T070000
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BEGIN:VEVENT
DTSTART:20240925T140000Z
DTEND:20240925T150000Z
DTSTAMP:20260420T014321
CREATED:20240905T144240Z
LAST-MODIFIED:20240905T144240Z
UID:27223-1727254800-1727258400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-12/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240926T150000Z
DTEND:20240926T160000Z
DTSTAMP:20260420T014321
CREATED:20240904T124943Z
LAST-MODIFIED:20240904T124943Z
UID:27379-1727344800-1727348400@hdpusergroup.org
SUMMARY:TCE materials -New Project Idea Call
DESCRIPTION:There has been multiple studies related to the TCE of laminate materials as related to the Z-axis. However\, the hypothesis is that better dimensional properties of laminates in the X-Y axis is equally critical and will positively affect solder joint reliability. A relative comparison of laminates is needed. SAC 305 alloy and SnPb will be evaluated as part of the project. Project team will select the harshest test parameters. Test vehicle will include a dimensional test coupon and features to assemble CABGA 192 components (package size 14mm X 14mm). The project will also consider evaluating a larger BGA to compare to the CABGA. \nThe project will evaluate several materials that have significant differences in the TCE in X-Y and Z axis. In addition\, glass cloth styles and thickness may also play a role in the XY expansion. The Project team will also select several glass styles as part of the evaluation. \n  \nThere are three possible thermal profiles to measure reliability. These are: \n  \n\n0 to 100 Celsius\n-40 to 125 Celsius\n-55 to 125 Celsius\n\nThe team will chose two of the thermal cycles. 
URL:https://hdpusergroup.org/event/tce-materials-new-project-idea-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240926T210000Z
DTEND:20240926T220000Z
DTSTAMP:20260420T014321
CREATED:20240912T214140Z
LAST-MODIFIED:20240912T214140Z
UID:27636-1727366400-1727370000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-5/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240927T020000Z
DTEND:20240927T030000Z
DTSTAMP:20260420T014321
CREATED:20240919T235426Z
LAST-MODIFIED:20240919T235426Z
UID:27767-1727384400-1727388000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-7/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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