BEGIN:VCALENDAR
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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
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BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
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BEGIN:VEVENT
DTSTART:20240826T150000Z
DTEND:20240826T160000Z
DTSTAMP:20260420T000955
CREATED:20240729T163734Z
LAST-MODIFIED:20240729T163734Z
UID:27075-1724666400-1724670000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-50/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240827T200000Z
DTEND:20240827T210000Z
DTSTAMP:20260420T000955
CREATED:20240821T143606Z
LAST-MODIFIED:20240821T143606Z
UID:27222-1724770800-1724774400@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Status of final report 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-26/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240828T140000Z
DTEND:20240828T150000Z
DTSTAMP:20260420T000955
CREATED:20240726T140636Z
LAST-MODIFIED:20240726T140636Z
UID:27061-1724835600-1724839200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-13/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240828T200000Z
DTEND:20240828T210000Z
DTSTAMP:20260420T000955
CREATED:20240821T200605Z
LAST-MODIFIED:20240821T200605Z
UID:27106-1724857200-1724860800@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue scoping out the project 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-5/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240829T150000Z
DTEND:20240829T160000Z
DTSTAMP:20260420T000955
CREATED:20240731T153940Z
LAST-MODIFIED:20240731T153940Z
UID:27080-1724925600-1724929200@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-23/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240829T160000Z
DTEND:20240829T170000Z
DTSTAMP:20260420T000955
CREATED:20240815T163809Z
LAST-MODIFIED:20240815T163809Z
UID:27212-1724929200-1724932800@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Many of the methods used for modeling cu surface roughness are out of date. Some models being used are from the 1960s. New modleing tools include recently developed Hurray model capabilities whose results fit the measured values well– assuming one knows what Hurray Parameters to input. Determining the appropriate Hurray model depends on structure and roughness values\, as each copper surface can have different roughness.This new tool lacks validation. The question remains if the modeling tool provides adequate sensitivity and is applicable across a wide range of copper foils\, oxide treatments\, materials\, and transmission line structures. This project will develop a plan to demonstrate/verify that real world inputs into the tool provide a good prediction of future results without post analysis and tweaking of the inputs.  
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-14/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR