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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
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BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
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BEGIN:VEVENT
DTSTART:20240820T150000Z
DTEND:20240820T160000Z
DTSTAMP:20260420T014201
CREATED:20240806T200935Z
LAST-MODIFIED:20240806T200935Z
UID:27042-1724148000-1724151600@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Status of testing 
URL:https://hdpusergroup.org/event/better-caf-eq-40/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240820T173000Z
DTEND:20240820T183000Z
DTSTAMP:20260420T014201
CREATED:20240808T134253Z
LAST-MODIFIED:20240808T134253Z
UID:27108-1724157000-1724160600@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluation\, Phase 4 -- Kickoff Meeting
DESCRIPTION:The idea for the next phase of solder joint evaluations was presented by Richard at the May member meeting. The basic objective is to characterize the board level solder joint reliability of a WLCSP package with a matrix of high-performance solder alloys. We are now ready to have a kickoff call for this project.  
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluation-phase-4-kickoff-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240820T200000Z
DTEND:20240820T210000Z
DTSTAMP:20260420T014201
CREATED:20240815T114644Z
LAST-MODIFIED:20240815T114644Z
UID:27209-1724166000-1724169600@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Continue working on the last bit of the project \nWork on final report 
URL:https://hdpusergroup.org/event/photonic-soldering-2-24/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240821T130000Z
DTEND:20240821T133000Z
DTSTAMP:20260420T014201
CREATED:20240820T201700Z
LAST-MODIFIED:20240820T201700Z
UID:27220-1724227200-1724229000@hdpusergroup.org
SUMMARY:test
DESCRIPTION:test 
URL:https://hdpusergroup.org/event/test-7/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240821T140000Z
DTEND:20240821T150000Z
DTSTAMP:20260420T014201
CREATED:20240717T142954Z
LAST-MODIFIED:20240717T142954Z
UID:27046-1724230800-1724234400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-11/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240821T150000Z
DTEND:20240821T160000Z
DTSTAMP:20260420T014201
CREATED:20240723T141018Z
LAST-MODIFIED:20240723T141018Z
UID:27059-1724234400-1724238000@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-28/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240822T010000Z
DTEND:20240822T020000Z
DTSTAMP:20260420T014201
CREATED:20240801T020442Z
LAST-MODIFIED:20240801T020442Z
UID:27082-1724270400-1724274000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-4/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240822T150000Z
DTEND:20240822T160000Z
DTSTAMP:20260420T014201
CREATED:20240725T144744Z
LAST-MODIFIED:20240725T144744Z
UID:27066-1724320800-1724324400@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Result of AGC press experiment \nSanmina determine # of panels in a rack \nIvan's input 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-14/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240822T160000Z
DTEND:20240822T170000Z
DTSTAMP:20260420T014201
CREATED:20240725T152038Z
LAST-MODIFIED:20240725T152038Z
UID:27067-1724324400-1724328000@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-14/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240822T210000Z
DTEND:20240822T220000Z
DTSTAMP:20260420T014201
CREATED:20240801T221551Z
LAST-MODIFIED:20240801T221551Z
UID:27093-1724342400-1724346000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-3/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240822T230000Z
DTEND:20240823T000000Z
DTSTAMP:20260420T014201
CREATED:20240802T145531Z
LAST-MODIFIED:20240802T145531Z
UID:27095-1724349600-1724353200@hdpusergroup.org
SUMMARY:Porosity Testing
DESCRIPTION:IST update \nPhoto instructions \nWork on schedule 
URL:https://hdpusergroup.org/event/porosity-testing-2/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR