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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
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TZOFFSETFROM:-0600
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DTSTART:20240310T080000
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BEGIN:VEVENT
DTSTART:20240806T150000Z
DTEND:20240806T160000Z
DTSTAMP:20260420T014043
CREATED:20240723T160450Z
LAST-MODIFIED:20240723T160450Z
UID:27060-1722938400-1722942000@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Review most recent version of final report \nDiscuss possible new project 
URL:https://hdpusergroup.org/event/microvia-rel-50/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240806T170000Z
DTEND:20240806T180000Z
DTSTAMP:20260420T014043
CREATED:20240702T173253Z
LAST-MODIFIED:20240702T173253Z
UID:26930-1722945600-1722949200@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-3/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240807T150000Z
DTEND:20240807T160000Z
DTSTAMP:20260420T014043
CREATED:20240724T153555Z
LAST-MODIFIED:20240724T153555Z
UID:27062-1723024800-1723028400@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-13/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240807T200000Z
DTEND:20240807T210000Z
DTSTAMP:20260420T014043
CREATED:20240725T203523Z
LAST-MODIFIED:20240725T203523Z
UID:27069-1723042800-1723046400@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Look at new artwork \nStatus of possible service provider 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-4/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240808T180000Z
DTEND:20240808T190000Z
DTSTAMP:20260420T014043
CREATED:20240801T180153Z
LAST-MODIFIED:20240801T180153Z
UID:27089-1723122000-1723125600@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Historically\, UL considered glass reinforcement an inert portion of the laminate composition. Glass styles were tested based on a range of thicknesses. Recently UL data showed differences in performance between E-glass and Low Dk-glass. Modern circuit design trends require Low Dk-glass for microvia technology. They enable\, improved CAF resistance\, and extend the usable frequency range.PWBs are exposed to sustained and cyclic temperatures when installed in end products. Laminate RTI and PWB MOT ratings are used to mitigate risk of Fire and Electric shock. Laminates provide mechanical support\, dielectric insulation and flammability properties for the PWB to support traces and components and maintain electrical clearance and creepage spacing. Degradation and material variation investigations are important to understand the material performance does not change over time.The question is how these glass trends affect the laminate performance from a short- and long-term degradation perspective. This project will evaluate the need for additional testing of Low Dk glass types.  
URL:https://hdpusergroup.org/event/glass-type-comparison-11/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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