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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
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DTSTART:20240310T080000
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DTSTART:20241103T070000
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BEGIN:VEVENT
DTSTART:20240723T150000Z
DTEND:20240723T160000Z
DTSTAMP:20260420T014221
CREATED:20240708T162242Z
LAST-MODIFIED:20240708T162242Z
UID:27021-1721728800-1721732400@hdpusergroup.org
SUMMARY:Microvia Reliability
DESCRIPTION:Continuing to review final report 
URL:https://hdpusergroup.org/event/microvia-reliability-4/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240724T140000Z
DTEND:20240724T150000Z
DTSTAMP:20260420T014221
CREATED:20240710T141037Z
LAST-MODIFIED:20240710T141037Z
UID:27024-1721811600-1721815200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-12/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240724T150000Z
DTEND:20240724T160000Z
DTSTAMP:20260420T014221
CREATED:20240710T165503Z
LAST-MODIFIED:20240710T165503Z
UID:27026-1721815200-1721818800@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-12/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20240725T140000Z
DTEND:20240725T150000Z
DTSTAMP:20260420T014221
CREATED:20240718T160104Z
LAST-MODIFIED:20240718T160104Z
UID:27052-1721898000-1721901600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Response from Singapore \nNext steps 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-3/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240725T150000Z
DTEND:20240725T160000Z
DTSTAMP:20260420T014221
CREATED:20240627T153219Z
LAST-MODIFIED:20240627T153219Z
UID:26896-1721901600-1721905200@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-13/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240725T200000Z
DTEND:20240725T210000Z
DTSTAMP:20260420T014221
CREATED:20240710T202911Z
LAST-MODIFIED:20240710T202911Z
UID:27027-1721919600-1721923200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue scoping out the project 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-3/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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