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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
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DTSTART:20240310T080000
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DTSTART:20241103T070000
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BEGIN:VEVENT
DTSTART:20240708T150000Z
DTEND:20240708T160000Z
DTSTAMP:20260420T032415
CREATED:20240610T154521Z
LAST-MODIFIED:20240610T154521Z
UID:26786-1720432800-1720436400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-48/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20240708T160000Z
DTEND:20240708T170000Z
DTSTAMP:20260420T032415
CREATED:20240619T163547Z
LAST-MODIFIED:20240619T163547Z
UID:26815-1720436400-1720440000@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Continue working on final report \nAny ideas/interest in another microvia project? 
URL:https://hdpusergroup.org/event/microvia-rel-49/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20240710T140000Z
DTEND:20240710T150000Z
DTSTAMP:20260420T032415
CREATED:20240710T134646Z
LAST-MODIFIED:20240710T134646Z
UID:26553-1720602000-1720605600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CFT at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CFT at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-cft-at-ist-phase-2-project-call/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20240710T150000Z
DTEND:20240710T160000Z
DTSTAMP:20260420T032415
CREATED:20240529T145201Z
LAST-MODIFIED:20240529T145201Z
UID:26752-1720605600-1720609200@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-21/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240710T160000Z
DTEND:20240710T170000Z
DTSTAMP:20260420T032415
CREATED:20240626T161217Z
LAST-MODIFIED:20240626T161217Z
UID:26892-1720609200-1720612800@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-11/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240710T200000Z
DTEND:20240710T210000Z
DTSTAMP:20260420T032415
CREATED:20240625T202541Z
LAST-MODIFIED:20240625T202541Z
UID:26891-1720623600-1720627200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue pulling things together to move from Idea to Definition 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-2/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240711T150000Z
DTEND:20240711T160000Z
DTSTAMP:20260420T032415
CREATED:20240529T153334Z
LAST-MODIFIED:20240529T153334Z
UID:26753-1720692000-1720695600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-32/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240711T200000Z
DTEND:20240711T210000Z
DTSTAMP:20260420T032415
CREATED:20240626T183539Z
LAST-MODIFIED:20240626T183539Z
UID:26894-1720710000-1720713600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Starting on final report \nStatus on drop testing 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-25/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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