BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240624T160000Z
DTEND:20240624T170000Z
DTSTAMP:20260420T045301
CREATED:20240603T165519Z
LAST-MODIFIED:20240603T165519Z
UID:26773-1719226800-1719230400@hdpusergroup.org
SUMMARY:Copper surface roughness model
DESCRIPTION:REview SEM and roughness model numbers. Update on Hurray Model. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-12/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240625T200000Z
DTEND:20240625T210000Z
DTSTAMP:20260420T045301
CREATED:20240614T183511Z
LAST-MODIFIED:20240614T183511Z
UID:26804-1719327600-1719331200@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue scoping put the project 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240626T150000Z
DTEND:20240626T160000Z
DTSTAMP:20260420T045301
CREATED:20240612T160251Z
LAST-MODIFIED:20240612T160251Z
UID:26793-1719396000-1719399600@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-10/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240627T150000Z
DTEND:20240627T160000Z
DTSTAMP:20260420T045301
CREATED:20240610T145141Z
LAST-MODIFIED:20240610T145141Z
UID:26763-1719482400-1719486000@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-12/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240627T210000Z
DTEND:20240627T220000Z
DTSTAMP:20260420T045301
CREATED:20240613T231044Z
LAST-MODIFIED:20240613T231044Z
UID:26803-1719504000-1719507600@hdpusergroup.org
SUMMARY:Idea discussion: Glass Substrates for IC Packages
DESCRIPTION:Idea discussion: Glass Substrates for IC Packages
URL:https://hdpusergroup.org/event/idea-discussion-glass-substrates-for-ic-packages-5/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240627T230000Z
DTEND:20240628T000000Z
DTSTAMP:20260420T045301
CREATED:20240617T124646Z
LAST-MODIFIED:20240617T124646Z
UID:26761-1719511200-1719514800@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Coninue working on project definition 
URL:https://hdpusergroup.org/event/porosity-9/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR