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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
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DTSTART:20240310T080000
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TZOFFSETFROM:-0500
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DTSTART:20241103T070000
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BEGIN:VEVENT
DTSTART:20240513T150000Z
DTEND:20240513T160000Z
DTSTAMP:20260420T062333
CREATED:20240512T231709Z
LAST-MODIFIED:20240512T231709Z
UID:26529-1715594400-1715598000@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Test status updates \nReview Member Meeting presentation 
URL:https://hdpusergroup.org/event/better-caf-eq-37/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240514T160000Z
DTEND:20240514T170000Z
DTSTAMP:20260420T062333
CREATED:20240430T150305Z
LAST-MODIFIED:20240430T150305Z
UID:26300-1715684400-1715688000@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Are we ready to build? \nLook at presentation for Member Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-12/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240515T140000Z
DTEND:20240515T150000Z
DTSTAMP:20260420T062333
CREATED:20240501T144845Z
LAST-MODIFIED:20240501T144845Z
UID:26303-1715763600-1715767200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-11/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240515T150000Z
DTEND:20240515T160000Z
DTSTAMP:20260420T062333
CREATED:20240501T155522Z
LAST-MODIFIED:20240501T155522Z
UID:26304-1715767200-1715770800@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting \n  \n  \n  
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-8/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240515T200000Z
DTEND:20240515T210000Z
DTSTAMP:20260420T062333
CREATED:20240507T141541Z
LAST-MODIFIED:20240507T141541Z
UID:26356-1715785200-1715788800@hdpusergroup.org
SUMMARY:NEW PROJECT - Outer Trace Adhesion
DESCRIPTION:HDP recently completed a project about the adhesion strength of inner layer copper traces.  This new project proposes to investigate and validate a quantitative test method for determining the adhesion strength of ultra thin traces on the outside of a PCB.  Come bring your ideas to this kick-off meeting. 
URL:https://hdpusergroup.org/event/new-project-outer-trace-adhesion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240516T140000Z
DTEND:20240516T150000Z
DTSTAMP:20260420T062333
CREATED:20240502T152547Z
LAST-MODIFIED:20240502T152547Z
UID:26311-1715850000-1715853600@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-24/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240517T010000Z
DTEND:20240517T020000Z
DTSTAMP:20260420T062333
CREATED:20240507T135008Z
LAST-MODIFIED:20240507T135008Z
UID:26353-1715889600-1715893200@hdpusergroup.org
SUMMARY:Dry run with linked agenda and final presentations
DESCRIPTION:Dry run on linked presentations and final copies and ID of presenters. 
URL:https://hdpusergroup.org/event/dry-run-with-linked-agenda-and-final-presentations/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
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