BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240325T160000Z
DTEND:20240325T170000Z
DTSTAMP:20260420T092600
CREATED:20240315T153919Z
LAST-MODIFIED:20240315T153919Z
UID:25888-1711364400-1711368000@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:REview latest results of the Huray model project. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-11/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240326T010000Z
DTEND:20240326T020000Z
DTSTAMP:20260420T092600
CREATED:20240131T013018Z
LAST-MODIFIED:20240131T013018Z
UID:25415-1711396800-1711400400@hdpusergroup.org
SUMMARY:Non Contact Copper Foil Profile Project Call
DESCRIPTION:Non Contact Copper Foil Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-copper-foil-profile-project-call-3/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240326T170000Z
DTEND:20240326T180000Z
DTSTAMP:20260420T092600
CREATED:20240320T234508Z
LAST-MODIFIED:20240320T234508Z
UID:25907-1711454400-1711458000@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Discuss info package for Sanmina 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-10/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240326T230000Z
DTEND:20240327T000000Z
DTSTAMP:20260420T092600
CREATED:20240312T234918Z
LAST-MODIFIED:20240312T234918Z
UID:25863-1711476000-1711479600@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Nail down test methods\, finishes and work and who will do what. 
URL:https://hdpusergroup.org/event/porosity-5/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240327T140000Z
DTEND:20240327T150000Z
DTSTAMP:20260420T092600
CREATED:20240306T153227Z
LAST-MODIFIED:20240306T153227Z
UID:25825-1711530000-1711533600@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-7/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240327T150000Z
DTEND:20240327T160000Z
DTSTAMP:20260420T092600
CREATED:20240306T161502Z
LAST-MODIFIED:20240306T161502Z
UID:25826-1711533600-1711537200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-9/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240327T160000Z
DTEND:20240327T170000Z
DTSTAMP:20260420T092600
CREATED:20240307T144630Z
LAST-MODIFIED:20240307T144630Z
UID:25818-1711537200-1711540800@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-8/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240328T160000Z
DTEND:20240328T170000Z
DTSTAMP:20260420T092600
CREATED:20240306T182040Z
LAST-MODIFIED:20240306T182040Z
UID:25829-1711623600-1711627200@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-5/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240329T160000Z
DTEND:20240329T170000Z
DTSTAMP:20260420T092600
CREATED:20240328T214155Z
LAST-MODIFIED:20240328T214155Z
UID:26023-1711710000-1711713600@hdpusergroup.org
SUMMARY:Call with Devan
DESCRIPTION:Call to discuss Glass substrate assembly. 
URL:https://hdpusergroup.org/event/call-with-devan/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240329T210000Z
DTEND:20240329T220000Z
DTSTAMP:20260420T092600
CREATED:20240327T224903Z
LAST-MODIFIED:20240327T224903Z
UID:26012-1711728000-1711731600@hdpusergroup.org
SUMMARY:Idea discussion: Glass substrates for IC packages
DESCRIPTION:Idea discussion: Glass substrates for IC packages 
URL:https://hdpusergroup.org/event/idea-discussion-glass-substrates-for-ic-packages/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR