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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
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DTSTART:20240310T080000
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DTSTART:20241103T070000
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BEGIN:VEVENT
DTSTART:20240213T160000Z
DTEND:20240213T170000Z
DTSTAMP:20260420T125103
CREATED:20240201T230020Z
LAST-MODIFIED:20240201T230020Z
UID:25420-1707818400-1707822000@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-6/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240213T170000Z
DTEND:20240213T180000Z
DTSTAMP:20260420T125103
CREATED:20240213T165747Z
LAST-MODIFIED:20240213T165747Z
UID:25061-1707822000-1707825600@hdpusergroup.org
SUMMARY:New Project idea High Speed Coupon
DESCRIPTION:An HDP member proposed this new HDP project idea at HDP Member Meeting in October\, and other members have expressed interest. After two HDP “New Idea” meetings\, the status of the now revised new project idea as of the January 16 Webex call is as follows: \n\nThe Team has discussed two different purposes for this kind of testing; DVT for design verification/validation testing and for ongoing volume production control. There are many different DVT test methods being used and for a variety of reasons. As frustrating as this is for the laminate manufacturers who are developing new materials\, the concensus appears that it is unrealistic to think that HDP can come up with a very high frequency test coupon that everyone in the industry would agree to use beyond requiring a general higher speed 4-wire test method.\n \n \nThere is some interest by the participants in this new project undertaking to learn the ability of more practical volume production signal integrity test methods (ex: Delta-L V4\, Cisco’s S-3) to detect certain “minor” PCB Fab manufacturing variations which would not be acceptable in higher speed applications. Possible factors of interest include:\n* Resin Content 65% versus 75%\n* Nominal trace width change of more than 10 percent\n* Change of alternate oxide treatment and/or significant change in the depth of etch\n* Copper foil change from HVLP-2 to HVLP-1 or to RTF-2\nNote these changes may be combined and not significantly affect the standard board impedance test results.\n \nThe goals for the meeting on Feb 13 are for the team to discuss further and better define this new project\, then to select a project technical content leader.\nNote HDP Facilitator (Karl Sauter) does the project admin and work on resources.\n \nTo participate in this project\, send email to: Karls@hdpug.org\n\n  
URL:https://hdpusergroup.org/event/new-project-idea-high-speed-coupon/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240213T230000Z
DTEND:20240214T000000Z
DTSTAMP:20260420T125103
CREATED:20240207T170119Z
LAST-MODIFIED:20240207T170119Z
UID:25572-1707843600-1707847200@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Do we proceed or not? 
URL:https://hdpusergroup.org/event/porosity-2/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240214T160000Z
DTEND:20240214T170000Z
DTSTAMP:20260420T125103
CREATED:20240124T153134Z
LAST-MODIFIED:20240124T153134Z
UID:25343-1707904800-1707908400@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-20/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240214T170000Z
DTEND:20240214T180000Z
DTSTAMP:20260420T125103
CREATED:20240110T183102Z
LAST-MODIFIED:20240110T183102Z
UID:25155-1707908400-1707912000@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Data collection complete. discuss final report. 
URL:https://hdpusergroup.org/event/glass-type-comparison-9/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240215T080000Z
DTEND:20240215T090000Z
DTSTAMP:20260420T125103
CREATED:20240215T052834Z
LAST-MODIFIED:20240215T052834Z
UID:25665-1707962400-1707966000@hdpusergroup.org
SUMMARY:CoTech New Project Idea Discussion
DESCRIPTION:CoTech New Project Idea Discussion 
URL:https://hdpusergroup.org/event/cotech-new-project-idea-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240215T170000Z
DTEND:20240215T180000Z
DTSTAMP:20260420T125103
CREATED:20240208T205258Z
LAST-MODIFIED:20240208T205258Z
UID:25597-1707994800-1707998400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Review draft presentation for Members' Meeting 
URL:https://hdpusergroup.org/event/microvia-rel-42/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240215T180000Z
DTEND:20240215T190000Z
DTSTAMP:20260420T125103
CREATED:20240124T183217Z
LAST-MODIFIED:20240124T183217Z
UID:25359-1707998400-1708002000@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Keysight status on drop testing and ATC \nWork on presentation for annual meeting 
URL:https://hdpusergroup.org/event/photonic-soldering-2-18/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240215T190000Z
DTEND:20240215T200000Z
DTSTAMP:20260420T125103
CREATED:20240131T200329Z
LAST-MODIFIED:20240131T200329Z
UID:25417-1708002000-1708005600@hdpusergroup.org
SUMMARY:PFAS Discussion
DESCRIPTION:Discussion of PFAS project 
URL:https://hdpusergroup.org/event/pfas-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240215T200000Z
DTEND:20240215T210000Z
DTSTAMP:20260420T125103
CREATED:20240213T211054Z
LAST-MODIFIED:20240213T211054Z
UID:25658-1708005600-1708009200@hdpusergroup.org
SUMMARY:VeCS discussion
DESCRIPTION:Call to discuss unauthorized data release 
URL:https://hdpusergroup.org/event/vecs-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR