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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
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BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
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BEGIN:VEVENT
DTSTART:20240205T160000Z
DTEND:20240205T170000Z
DTSTAMP:20260420T110605
CREATED:20240122T162740Z
LAST-MODIFIED:20240122T162740Z
UID:25314-1707127200-1707130800@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-40/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240206T160000Z
DTEND:20240206T170000Z
DTSTAMP:20260420T110605
CREATED:20240205T175210Z
LAST-MODIFIED:20240205T175210Z
UID:25497-1707213600-1707217200@hdpusergroup.org
SUMMARY:Discussion on MM presentation
DESCRIPTION:Discussion 
URL:https://hdpusergroup.org/event/discussion-on-mm-presentation/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240206T170000Z
DTEND:20240206T180000Z
DTSTAMP:20260420T110605
CREATED:20240128T145531Z
LAST-MODIFIED:20240128T145531Z
UID:25404-1707217200-1707220800@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Many of the methods used for modeling cu surface roughness are out of date. Some models being used are from the 1960s. New modleing tools include recently developed Hurray model capabilities whose results fit the measured values well– assuming one knows what Hurray Parameters to input. Determining the appropriate Hurray model depends on structure and roughness values\, as each copper surface can have different roughness. \nThis new tool lacks validation. The question remains if the modeling tool provides adequate sensitivity and is applicable across a wide range of copper foils\, oxide treatments\, materials\, and transmission line structures. This project will develop a plan to demonstrate/verify that real world inputs into the tool provide a good prediction of future results without post analysis and tweaking of the inputs.  
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-12/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240206T180000Z
DTEND:20240206T190000Z
DTSTAMP:20260420T110605
CREATED:20240116T152214Z
LAST-MODIFIED:20240116T152214Z
UID:25251-1707220800-1707224400@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-5/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240206T230000Z
DTEND:20240207T000000Z
DTSTAMP:20260420T110605
CREATED:20240130T204027Z
LAST-MODIFIED:20240130T204027Z
UID:25147-1707238800-1707242400@hdpusergroup.org
SUMMARY:Porosity Testing
DESCRIPTION:Look at test methods \nPass/fail criteria \nDown select finishes to test 
URL:https://hdpusergroup.org/event/porosity-testing/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240207T150000Z
DTEND:20240207T160000Z
DTSTAMP:20260420T110605
CREATED:20240124T173045Z
LAST-MODIFIED:20240124T173045Z
UID:25352-1707296400-1707300000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-26/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240207T160000Z
DTEND:20240207T170000Z
DTSTAMP:20260420T110605
CREATED:20240117T164725Z
LAST-MODIFIED:20240117T164725Z
UID:25300-1707300000-1707303600@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-17/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240207T170000Z
DTEND:20240207T180000Z
DTSTAMP:20260420T110605
CREATED:20240103T220005Z
LAST-MODIFIED:20240103T220005Z
UID:25118-1707303600-1707307200@hdpusergroup.org
SUMMARY:Backdrill Transition Project
DESCRIPTION:HDP Backdrill Via Transition Project meeting 
URL:https://hdpusergroup.org/event/backdrill-transition-project-4/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240208T140000Z
DTEND:20240208T150000Z
DTSTAMP:20260420T110605
CREATED:20240112T191712Z
LAST-MODIFIED:20240112T191712Z
UID:25226-1707379200-1707382800@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Jason and Hubert \nPresentation for members; Meeting 
URL:https://hdpusergroup.org/event/better-caf-eq-35/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240208T160000Z
DTEND:20240208T170000Z
DTSTAMP:20260420T110605
CREATED:20240125T170359Z
LAST-MODIFIED:20240125T170359Z
UID:25395-1707386400-1707390000@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-2/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240208T170000Z
DTEND:20240208T180000Z
DTSTAMP:20260420T110605
CREATED:20240201T130247Z
LAST-MODIFIED:20240201T130247Z
UID:25418-1707390000-1707393600@hdpusergroup.org
SUMMARY:Permittivity of cooling Fluids
DESCRIPTION:Finalize dooling fluids project tasks as we ask for approval for Implementation 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-fluids-5/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240208T200000Z
DTEND:20240208T210000Z
DTSTAMP:20260420T110605
CREATED:20240111T205206Z
LAST-MODIFIED:20240111T205206Z
UID:25188-1707400800-1707404400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Updates from TMM\, Atotech and McDermid-Alpha 
URL:https://hdpusergroup.org/event/microvia-rel-43/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR