BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20230919T010000Z
DTEND:20230919T020000Z
DTSTAMP:20260420T193901
CREATED:20230829T035839Z
LAST-MODIFIED:20230829T035839Z
UID:24387-1695067200-1695070800@hdpusergroup.org
SUMMARY:Non Contact CF Profile Project Call
DESCRIPTION:Non Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-10/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230919T160000Z
DTEND:20230919T170000Z
DTSTAMP:20260420T193901
CREATED:20230830T012517Z
LAST-MODIFIED:20230830T012517Z
UID:24563-1695121200-1695124800@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Modelingf SI with use of Hurray model 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-6/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230919T170000Z
DTEND:20230919T180000Z
DTSTAMP:20260420T193901
CREATED:20230822T171410Z
LAST-MODIFIED:20230822T171410Z
UID:24541-1695124800-1695128400@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-3/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230920T160000Z
DTEND:20230920T170000Z
DTSTAMP:20260420T193901
CREATED:20230829T141847Z
LAST-MODIFIED:20230829T141847Z
UID:24534-1695207600-1695211200@hdpusergroup.org
SUMMARY:HDP Large Footprint BGA Warpage/Flatness Project
DESCRIPTION:Project Status Meeting - rescheduled due to a scheduling conflict \nThis project has been on hold since May 2023. It is time for us to move it forward or remove it from the roster of projects. 
URL:https://hdpusergroup.org/event/hdp-large-footprint-bga-warpage-flatness-project/
CATEGORIES:Large Footprint BGA Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230921T150000Z
DTEND:20230921T160000Z
DTSTAMP:20260420T193901
CREATED:20230823T152756Z
LAST-MODIFIED:20230823T152756Z
UID:24542-1695290400-1695294000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-21/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230921T160000Z
DTEND:20230921T170000Z
DTSTAMP:20260420T193901
CREATED:20230909T152537Z
LAST-MODIFIED:20230909T152537Z
UID:24503-1695294000-1695297600@hdpusergroup.org
SUMMARY:Inner Layer Cu Balance Project call
DESCRIPTION:  \nRescheduled ….Gary Out on Business \nReview measurement data and discuss phase 2 progress.
URL:https://hdpusergroup.org/event/inner-layer-cu-balance-project-call-3/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230921T200000Z
DTEND:20230921T210000Z
DTSTAMP:20260420T193901
CREATED:20230907T210455Z
LAST-MODIFIED:20230907T210455Z
UID:24693-1695308400-1695312000@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Updates from both Keysight sites 
URL:https://hdpusergroup.org/event/photonic-soldering-2-12/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR