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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20230312T080000
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DTSTART:20230829T150000Z
DTEND:20230829T160000Z
DTSTAMP:20260420T193747
CREATED:20230825T141424Z
LAST-MODIFIED:20230825T141424Z
UID:24550-1693303200-1693306800@hdpusergroup.org
SUMMARY:Call with Matt
DESCRIPTION:Call to discuss HDP 
URL:https://hdpusergroup.org/event/call-with-matt-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20230829T160000Z
DTEND:20230829T170000Z
DTSTAMP:20260420T193747
CREATED:20230808T164127Z
LAST-MODIFIED:20230808T164127Z
UID:24457-1693306800-1693310400@hdpusergroup.org
SUMMARY:Cu surface roughness model
DESCRIPTION:Continue review of the roughness for copper surface treatments. 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-11/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230830T150000Z
DTEND:20230830T160000Z
DTSTAMP:20260420T193747
CREATED:20230829T133223Z
LAST-MODIFIED:20230829T133223Z
UID:24556-1693389600-1693393200@hdpusergroup.org
SUMMARY:Discussion on external presentations - Inner Layer Cu Balance - IPC Expo
DESCRIPTION:Review abstract details  and discussion on external papers 
URL:https://hdpusergroup.org/event/discussion-on-external-presentations-inner-layer-cu-balance-ipc-expo/
CATEGORIES:Board Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20230830T180000Z
DTEND:20230830T190000Z
DTSTAMP:20260420T193747
CREATED:20230817T153042Z
LAST-MODIFIED:20230817T153042Z
UID:24521-1693400400-1693404000@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-30/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
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DTSTART:20230830T190000Z
DTEND:20230830T200000Z
DTSTAMP:20260420T193747
CREATED:20230816T194557Z
LAST-MODIFIED:20230816T194557Z
UID:24509-1693404000-1693407600@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Review stackup and layout \nPotentially hear back from PCB suppliers 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-3/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230901T140000Z
DTEND:20230901T150000Z
DTSTAMP:20260420T193747
CREATED:20230811T063034Z
LAST-MODIFIED:20230811T063034Z
UID:24400-1693558800-1693562400@hdpusergroup.org
SUMMARY:Quantify Changes in Reflow Cycles with Reliability Performance New Idea Project Call
DESCRIPTION:Quantify Changes in Reflow Cycles with Reliability Peformance – New Idea Project Call 
URL:https://hdpusergroup.org/event/quantify-changes-in-reflow-cycles-with-reliability-peformance-new-idea-project-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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