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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
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TZOFFSETFROM:-0500
TZOFFSETTO:-0600
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DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230815T160000Z
DTEND:20230815T170000Z
DTSTAMP:20260420T212826
CREATED:20230720T211107Z
LAST-MODIFIED:20230720T211107Z
UID:24398-1692097200-1692100800@hdpusergroup.org
SUMMARY:Inner Layer Cu Balancing Call
DESCRIPTION:Discussion on latest results and phase 2 planning 
URL:https://hdpusergroup.org/event/inner-layer-cu-balancing-call/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230816T020000Z
DTEND:20230816T030000Z
DTSTAMP:20260420T212826
CREATED:20230627T095200Z
LAST-MODIFIED:20230627T095200Z
UID:24126-1692133200-1692136800@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-47/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230816T150000Z
DTEND:20230816T160000Z
DTSTAMP:20260420T212826
CREATED:20230719T151453Z
LAST-MODIFIED:20230719T151453Z
UID:24391-1692180000-1692183600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Status of progress of the build 
URL:https://hdpusergroup.org/event/microvia-rel-36/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230816T190000Z
DTEND:20230816T200000Z
DTSTAMP:20260420T212826
CREATED:20230802T195308Z
LAST-MODIFIED:20230802T195308Z
UID:24444-1692194400-1692198000@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Examne Bob's layup \nAnyone willing to build? 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-2/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230817T140000Z
DTEND:20230817T150000Z
DTSTAMP:20260420T212826
CREATED:20230816T160528Z
LAST-MODIFIED:20230816T160528Z
UID:24507-1692262800-1692266400@hdpusergroup.org
SUMMARY:Call to discuss Cu Peel final report and Board request
DESCRIPTION:Discuss presentation and final report 
URL:https://hdpusergroup.org/event/call-to-discuss-cu-peel-final-report-and-board-request/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230817T150000Z
DTEND:20230817T160000Z
DTSTAMP:20260420T212826
CREATED:20230726T184036Z
LAST-MODIFIED:20230726T184036Z
UID:24415-1692266400-1692270000@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-29/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230817T190000Z
DTEND:20230817T200000Z
DTSTAMP:20260420T212826
CREATED:20230727T155901Z
LAST-MODIFIED:20230727T155901Z
UID:24422-1692280800-1692284400@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-6/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230818T140000Z
DTEND:20230818T150000Z
DTSTAMP:20260420T212826
CREATED:20230728T141240Z
LAST-MODIFIED:20230728T141240Z
UID:24424-1692349200-1692352800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230818T150000Z
DTEND:20230818T160000Z
DTSTAMP:20260420T212826
CREATED:20230728T155552Z
LAST-MODIFIED:20230728T155552Z
UID:24425-1692352800-1692356400@hdpusergroup.org
SUMMARY:Permittivity of Cooling Liquids
DESCRIPTION:Cooling fluids used for immeresed electronic systems. \nMeasuring peformance and reliability. 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-liquids-5/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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END:VCALENDAR