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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
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TZOFFSETFROM:-0600
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DTSTART:20230312T080000
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DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230807T150000Z
DTEND:20230807T160000Z
DTSTAMP:20260420T212927
CREATED:20230717T154424Z
LAST-MODIFIED:20230717T154424Z
UID:24383-1691402400-1691406000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequncy 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-27/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20230808T160000Z
DTEND:20230808T170000Z
DTSTAMP:20260420T212927
CREATED:20230719T021242Z
LAST-MODIFIED:20230719T021242Z
UID:24389-1691492400-1691496000@hdpusergroup.org
SUMMARY:cu Surface Roughness Model
DESCRIPTION:Many of the methods used for modeling cu surface roughness are out of date. Some models being used are from the 1960s. New modleing tools include recently developed Hurray model capabilities whose results fit the measured values well– assuming one knows what Hurray Parameters to input. Determining the appropriate Hurray model depends on structure and roughness values\, as each copper surface can have different roughness.This new tool lacks validation. The question remains if the modeling tool provides adequate sensitivity and is applicable across a wide range of copper foils\, oxide treatments\, materials\, and transmission line structures. This project will develop a plan to demonstrate/verify that real world inputs into the tool provide a good prediction of future results without post analysis and tweaking of the inputs.  
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-10/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230808T230000Z
DTEND:20230808T233000Z
DTSTAMP:20260420T212927
CREATED:20230808T132509Z
LAST-MODIFIED:20230808T132509Z
UID:24452-1691517600-1691519400@hdpusergroup.org
SUMMARY:test webex sync from prod
DESCRIPTION:test 
URL:https://hdpusergroup.org/event/test-webex-sync-from-prod/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230809T150000Z
DTEND:20230809T160000Z
DTSTAMP:20260420T212927
CREATED:20230713T154709Z
LAST-MODIFIED:20230713T154709Z
UID:24369-1691575200-1691578800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-10/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230810T150000Z
DTEND:20230810T160000Z
DTSTAMP:20260420T212927
CREATED:20230720T152029Z
LAST-MODIFIED:20230720T152029Z
UID:24397-1691661600-1691665200@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-12/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230810T200000Z
DTEND:20230810T210000Z
DTSTAMP:20260420T212927
CREATED:20230727T193922Z
LAST-MODIFIED:20230727T193922Z
UID:24423-1691679600-1691683200@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Progress on ATC and drop testing 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-22/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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