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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZOFFSETFROM:-0600
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DTSTART:20230312T080000
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DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230725T170000Z
DTEND:20230725T180000Z
DTSTAMP:20260421T005938
CREATED:20230703T150953Z
LAST-MODIFIED:20230703T150953Z
UID:24356-1690286400-1690290000@hdpusergroup.org
SUMMARY:HDP Harsh USe Alloy Evaluations project call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-project-call-2/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230726T150000Z
DTEND:20230726T160000Z
DTSTAMP:20260421T005938
CREATED:20230621T152650Z
LAST-MODIFIED:20230621T152650Z
UID:24290-1690365600-1690369200@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-19/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20230726T160000Z
DTEND:20230726T170000Z
DTSTAMP:20260421T005938
CREATED:20230719T020751Z
LAST-MODIFIED:20230719T020751Z
UID:24388-1690369200-1690372800@hdpusergroup.org
SUMMARY:Copper Surface Peel Strength 2
DESCRIPTION:Discuss final report and close out 
URL:https://hdpusergroup.org/event/copper-surface-peel-strength-2/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20230726T180000Z
DTEND:20230726T190000Z
DTSTAMP:20260421T005938
CREATED:20230712T160506Z
LAST-MODIFIED:20230712T160506Z
UID:24365-1690376400-1690380000@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-28/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230726T190000Z
DTEND:20230726T200000Z
DTSTAMP:20260421T005938
CREATED:20230712T194320Z
LAST-MODIFIED:20230712T194320Z
UID:24366-1690380000-1690383600@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Continue fleshing out the project 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230727T150000Z
DTEND:20230727T160000Z
DTSTAMP:20260421T005938
CREATED:20230628T193601Z
LAST-MODIFIED:20230628T193601Z
UID:24347-1690452000-1690455600@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-5/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230727T190000Z
DTEND:20230727T200000Z
DTSTAMP:20260421T005938
CREATED:20230719T235939Z
LAST-MODIFIED:20230719T235939Z
UID:24348-1690466400-1690470000@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:If avaiable\, results of first drop \nStatus of ATC 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-21/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230728T140000Z
DTEND:20230728T150000Z
DTSTAMP:20260421T005938
CREATED:20230714T142414Z
LAST-MODIFIED:20230714T142414Z
UID:24373-1690534800-1690538400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-2/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230728T150000Z
DTEND:20230728T160000Z
DTSTAMP:20260421T005938
CREATED:20230719T023439Z
LAST-MODIFIED:20230719T023439Z
UID:24390-1690538400-1690542000@hdpusergroup.org
SUMMARY:Permittity of Coolng fluids
DESCRIPTION:Understandingn the performacne of cooling fluids in immersed electronic systems. \n  
URL:https://hdpusergroup.org/event/permittity-of-coolng-fluids/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
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