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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
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TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230625T133000Z
DTEND:20230625T140000Z
DTSTAMP:20260420T231555
CREATED:20230625T121134Z
LAST-MODIFIED:20230625T121134Z
UID:24303-1687681800-1687683600@hdpusergroup.org
SUMMARY:Testing
DESCRIPTION:Testing connection between website and WebEx. 
URL:https://hdpusergroup.org/event/testing/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230626T150000Z
DTEND:20230626T160000Z
DTSTAMP:20260420T231555
CREATED:20230612T153342Z
LAST-MODIFIED:20230612T153342Z
UID:24246-1687773600-1687777200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-25/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230627T140000Z
DTEND:20230627T150000Z
DTSTAMP:20260420T231555
CREATED:20230627T141442Z
LAST-MODIFIED:20230627T141442Z
UID:24339-1687856400-1687860000@hdpusergroup.org
SUMMARY:Test call
DESCRIPTION:Test meeting 
URL:https://hdpusergroup.org/event/test-call/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230627T160000Z
DTEND:20230627T170000Z
DTSTAMP:20260420T231555
CREATED:20230606T170730Z
LAST-MODIFIED:20230606T170730Z
UID:24229-1687863600-1687867200@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Hurray Model for roughness effect on signal integrity.  
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-4/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230627T170000Z
DTEND:20230627T180000Z
DTSTAMP:20260420T231555
CREATED:20230605T090411Z
LAST-MODIFIED:20230605T090411Z
UID:24225-1687867200-1687870800@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-2/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230627T180000Z
DTEND:20230627T190000Z
DTSTAMP:20260420T231555
CREATED:20230621T175358Z
LAST-MODIFIED:20230621T175358Z
UID:24291-1687870800-1687874400@hdpusergroup.org
SUMMARY:Meeting with Mark Shields
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/meeting-with-mark-shields/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230627T190000Z
DTEND:20230627T200000Z
DTSTAMP:20260420T231555
CREATED:20230626T140742Z
LAST-MODIFIED:20230626T140742Z
UID:24311-1687874400-1687878000@hdpusergroup.org
SUMMARY:Nonglass Buildups
DESCRIPTION:Continue fleshing out the basic ideas of the project. 
URL:https://hdpusergroup.org/event/nonglass-buildups/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230628T030000Z
DTEND:20230628T040000Z
DTSTAMP:20260420T231555
CREATED:20230627T061947Z
LAST-MODIFIED:20230627T061947Z
UID:24079-1687903200-1687906800@hdpusergroup.org
SUMMARY:IST-HDP Meeting
DESCRIPTION:IST-HDP Meeting 
URL:https://hdpusergroup.org/event/ist-hdp-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230628T150000Z
DTEND:20230628T160000Z
DTSTAMP:20260420T231555
CREATED:20230531T191740Z
LAST-MODIFIED:20230531T191740Z
UID:24217-1687946400-1687950000@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-4/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230628T160000Z
DTEND:20230628T170000Z
DTSTAMP:20260420T231555
CREATED:20230531T163127Z
LAST-MODIFIED:20230531T163127Z
UID:24214-1687950000-1687953600@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Reviewing results of different glass types.  
URL:https://hdpusergroup.org/event/glass-type-comparison-3/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230628T190000Z
DTEND:20230628T200000Z
DTSTAMP:20260420T231555
CREATED:20230531T204722Z
LAST-MODIFIED:20230531T204722Z
UID:24218-1687960800-1687964400@hdpusergroup.org
SUMMARY:Photosolder II
DESCRIPTION:Update on master document\, thermocoupling\, ATC and drop testing  
URL:https://hdpusergroup.org/event/photosolder-ii/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230629T150000Z
DTEND:20230629T160000Z
DTSTAMP:20260420T231555
CREATED:20230626T134800Z
LAST-MODIFIED:20230626T134800Z
UID:24309-1688032800-1688036400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Progress on Build 
URL:https://hdpusergroup.org/event/microvia-rel-34/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
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