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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
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TZOFFSETFROM:-0600
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DTSTART:20230312T080000
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TZOFFSETFROM:-0500
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DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230612T150000Z
DTEND:20230612T160000Z
DTSTAMP:20260421T005937
CREATED:20230515T154238Z
LAST-MODIFIED:20230515T154238Z
UID:24156-1686564000-1686567600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-24/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230614T150000Z
DTEND:20230614T160000Z
DTSTAMP:20260421T005937
CREATED:20230530T162101Z
LAST-MODIFIED:20230530T162101Z
UID:24209-1686736800-1686740400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-8/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230614T160000Z
DTEND:20230614T170000Z
DTSTAMP:20260421T005937
CREATED:20230525T144229Z
LAST-MODIFIED:20230525T144229Z
UID:24199-1686740400-1686744000@hdpusergroup.org
SUMMARY:Copper Peel Strength 2
DESCRIPTION:Determining reliability of materials based on peel strengths. And different copper foil types. 
URL:https://hdpusergroup.org/event/copper-peel-strength-2-4/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230615T150000Z
DTEND:20230615T160000Z
DTSTAMP:20260421T005937
CREATED:20230523T153809Z
LAST-MODIFIED:20230523T153809Z
UID:24191-1686823200-1686826800@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-26/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230616T140000Z
DTEND:20230616T150000Z
DTSTAMP:20260421T005937
CREATED:20230602T143121Z
LAST-MODIFIED:20230602T143121Z
UID:24221-1686906000-1686909600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF as IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF as IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-as-ist-phase-2-project-call/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230616T150000Z
DTEND:20230616T160000Z
DTSTAMP:20260421T005937
CREATED:20230606T171210Z
LAST-MODIFIED:20230606T171210Z
UID:24230-1686909600-1686913200@hdpusergroup.org
SUMMARY:Permittivity of Cooling Fluids
DESCRIPTION:In an immersion cooling system\, infrastructure equipment can be submerged in a non-conductive cooling liqui \nIdea is to develop a model to predict permittivity of different cooling liquids for improved reliability and energy efficiency \nCompare costs of each fluid vs other properties to determine best options. \nWhen using colling liquids for this application\, there is little understanding of the complex permittivity properties of these liquids \nThere are technical challenges that pose risks when trying to accurately model electrical performance of high-speed buses immersed in cooling liquids vs air \nWhat issues arise with permittivity when using different cooling liquids? 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-fluids/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
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