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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230530T160000Z
DTEND:20230530T170000Z
DTSTAMP:20260421T024723
CREATED:20230506T172408Z
LAST-MODIFIED:20230506T172408Z
UID:24106-1685444400-1685448000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-7/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230530T170000Z
DTEND:20230530T180000Z
DTSTAMP:20260421T024723
CREATED:20230504T132225Z
LAST-MODIFIED:20230504T132225Z
UID:24112-1685448000-1685451600@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations
DESCRIPTION:Periodic project review 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-4/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230531T150000Z
DTEND:20230531T160000Z
DTSTAMP:20260421T024723
CREATED:20230510T155504Z
LAST-MODIFIED:20230510T155504Z
UID:24139-1685527200-1685530800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-9/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230531T160000Z
DTEND:20230531T170000Z
DTSTAMP:20260421T024723
CREATED:20230504T160115Z
LAST-MODIFIED:20230504T160115Z
UID:24113-1685530800-1685534400@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Review status/results in progress for Phase 3 
URL:https://hdpusergroup.org/event/glass-type-comparison-2/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230531T170000Z
DTEND:20230531T180000Z
DTSTAMP:20260421T024723
CREATED:20230516T160806Z
LAST-MODIFIED:20230516T160806Z
UID:24163-1685534400-1685538000@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-3/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230531T200000Z
DTEND:20230531T210000Z
DTSTAMP:20260421T024723
CREATED:20230503T202855Z
LAST-MODIFIED:20230503T202855Z
UID:24110-1685545200-1685548800@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:% Au in solder joints. \nDrop test results\, if any. \nPresentation for Japan.
URL:https://hdpusergroup.org/event/photonic-soldering-ii-20/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230601T160000Z
DTEND:20230601T170000Z
DTSTAMP:20260421T024723
CREATED:20230518T161548Z
LAST-MODIFIED:20230518T161548Z
UID:24169-1685617200-1685620800@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project-4/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230601T180000Z
DTEND:20230601T190000Z
DTSTAMP:20260421T024723
CREATED:20230530T005210Z
LAST-MODIFIED:20230530T005210Z
UID:24116-1685624400-1685628000@hdpusergroup.org
SUMMARY:Inner layer Cu Balance Project Call
DESCRIPTION:  \nReview latest data
URL:https://hdpusergroup.org/event/inner-layer-cu-balance-project-call-4/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230602T140000Z
DTEND:20230602T150000Z
DTSTAMP:20260421T024723
CREATED:20230512T150548Z
LAST-MODIFIED:20230512T150548Z
UID:24148-1685696400-1685700000@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-27/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230602T150000Z
DTEND:20230602T160000Z
DTSTAMP:20260421T024723
CREATED:20230520T023655Z
LAST-MODIFIED:20230520T023655Z
UID:24176-1685700000-1685703600@hdpusergroup.org
SUMMARY:Permittivity of Cooling Liquids
DESCRIPTION:Cooling liquids are needed for certain electronic systems. what is not know is what liquids are more effective than others in terms of signal integrity and cost effectiveness. Additional concerns relate to degradation of the cabling and connectors used in these systems. 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-liquids-4/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR