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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230510T020000Z
DTEND:20230510T030000Z
DTSTAMP:20260421T060130
CREATED:20230315T044031Z
LAST-MODIFIED:20230315T044031Z
UID:23910-1683666000-1683669600@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-46/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230510T150000Z
DTEND:20230510T160000Z
DTSTAMP:20260421T060130
CREATED:20230426T145916Z
LAST-MODIFIED:20230426T145916Z
UID:24067-1683712800-1683716400@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-8/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230510T190000Z
DTEND:20230510T200000Z
DTSTAMP:20260421T060130
CREATED:20230427T165554Z
LAST-MODIFIED:20230427T165554Z
UID:24075-1683727200-1683730800@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss
DESCRIPTION:Final Call to review report and closure request. 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-7/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230511T150000Z
DTEND:20230511T160000Z
DTSTAMP:20260421T060130
CREATED:20230420T193816Z
LAST-MODIFIED:20230420T193816Z
UID:24058-1683799200-1683802800@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-24/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230511T180000Z
DTEND:20230511T190000Z
DTSTAMP:20260421T060130
CREATED:20230427T194109Z
LAST-MODIFIED:20230427T194109Z
UID:24077-1683810000-1683813600@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Status of final report \nConinue fleshing out phase 2 
URL:https://hdpusergroup.org/event/pcb-feature-min-38/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230511T200000Z
DTEND:20230511T210000Z
DTSTAMP:20260421T060130
CREATED:20230427T205743Z
LAST-MODIFIED:20230427T205743Z
UID:24078-1683817200-1683820800@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Design complete?  Ready to build? 
URL:https://hdpusergroup.org/event/microvia-rel-31/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230512T140000Z
DTEND:20230512T150000Z
DTSTAMP:20260421T060130
CREATED:20230428T162350Z
LAST-MODIFIED:20230428T162350Z
UID:24080-1683882000-1683885600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-26/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
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