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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
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TZOFFSETFROM:-0500
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TZNAME:CST
DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230424T150000Z
DTEND:20230424T160000Z
DTSTAMP:20260421T060152
CREATED:20230403T160208Z
LAST-MODIFIED:20230403T160208Z
UID:23979-1682330400-1682334000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-22/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230425T160000Z
DTEND:20230425T170000Z
DTSTAMP:20260421T060152
CREATED:20230412T154539Z
LAST-MODIFIED:20230412T154539Z
UID:24029-1682420400-1682424000@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Roughness Modeling evaluation 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-8/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230426T140000Z
DTEND:20230426T150000Z
DTSTAMP:20260421T060152
CREATED:20230405T152113Z
LAST-MODIFIED:20230405T152113Z
UID:23993-1682499600-1682503200@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-7/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230426T160000Z
DTEND:20230426T170000Z
DTSTAMP:20260421T060152
CREATED:20230412T163351Z
LAST-MODIFIED:20230412T163351Z
UID:24031-1682506800-1682510400@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Copper Peel Strength 2-results of peel testing omn different foils and resin systems 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-12/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230426T190000Z
DTEND:20230426T200000Z
DTSTAMP:20260421T060152
CREATED:20230426T142929Z
LAST-MODIFIED:20230426T142929Z
UID:24066-1682517600-1682521200@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss
DESCRIPTION:Review Final report 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-6/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230427T010000Z
DTEND:20230427T020000Z
DTSTAMP:20260421T060152
CREATED:20230331T012659Z
LAST-MODIFIED:20230331T012659Z
UID:23975-1682539200-1682542800@hdpusergroup.org
SUMMARY:Non Contact CF Profile Project Call
DESCRIPTION:Non Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call-6/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230427T150000Z
DTEND:20230427T160000Z
DTSTAMP:20260421T060152
CREATED:20230406T163456Z
LAST-MODIFIED:20230406T163456Z
UID:24001-1682589600-1682593200@hdpusergroup.org
SUMMARY:Sequential Lamination
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230427T160000Z
DTEND:20230427T170000Z
DTSTAMP:20260421T060152
CREATED:20230413T161845Z
LAST-MODIFIED:20230413T161845Z
UID:24034-1682593200-1682596800@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project-2/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230427T190000Z
DTEND:20230427T200000Z
DTSTAMP:20260421T060152
CREATED:20230413T193401Z
LAST-MODIFIED:20230413T193401Z
UID:24037-1682604000-1682607600@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Hopefully complete final report \nWork on defining next project 
URL:https://hdpusergroup.org/event/pcb-feature-min-37/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230427T200000Z
DTEND:20230427T210000Z
DTSTAMP:20260421T060152
CREATED:20230419T175724Z
LAST-MODIFIED:20230419T175724Z
UID:24056-1682607600-1682611200@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:More work on what we want to do 
URL:https://hdpusergroup.org/event/microvia-rel-30/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230428T140000Z
DTEND:20230428T150000Z
DTSTAMP:20260421T060152
CREATED:20230414T144410Z
LAST-MODIFIED:20230414T144410Z
UID:24040-1682672400-1682676000@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-25/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230428T150000Z
DTEND:20230428T160000Z
DTSTAMP:20260421T060152
CREATED:20230414T155539Z
LAST-MODIFIED:20230414T155539Z
UID:24041-1682676000-1682679600@hdpusergroup.org
SUMMARY:Permittivity of Cooling Liquids
DESCRIPTION:Follow-up Cooling Liquids 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-liquids-2/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR