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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230411T160000Z
DTEND:20230411T170000Z
DTSTAMP:20260421T060153
CREATED:20230327T143854Z
LAST-MODIFIED:20230327T143854Z
UID:23962-1681210800-1681214400@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Copper surface roughness modeling valiadation. 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-7/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230412T160000Z
DTEND:20230412T170000Z
DTSTAMP:20260421T060153
CREATED:20230330T135719Z
LAST-MODIFIED:20230330T135719Z
UID:23972-1681297200-1681300800@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Continued vetting of the results for peel strength  
URL:https://hdpusergroup.org/event/cu-peel-strength-2-11/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230412T200000Z
DTEND:20230412T210000Z
DTSTAMP:20260421T060153
CREATED:20230315T201721Z
LAST-MODIFIED:20230315T201721Z
UID:23912-1681311600-1681315200@hdpusergroup.org
SUMMARY:Photo Solder 2
DESCRIPTION:Ptrogress on: second reflow batch manufacture\, x-sectioing of same and drop testing 
URL:https://hdpusergroup.org/event/photo-solder-2-6/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230413T150000Z
DTEND:20230413T160000Z
DTSTAMP:20260421T060153
CREATED:20230323T153913Z
LAST-MODIFIED:20230323T153913Z
UID:23949-1681380000-1681383600@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-16/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230413T160000Z
DTEND:20230413T170000Z
DTSTAMP:20260421T060153
CREATED:20230323T162937Z
LAST-MODIFIED:20230323T162937Z
UID:23950-1681383600-1681387200@hdpusergroup.org
SUMMARY:HDP Backdrill Transition Project
DESCRIPTION:Project Call 
URL:https://hdpusergroup.org/event/hdp-backdrill-transition-project/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230413T190000Z
DTEND:20230413T200000Z
DTSTAMP:20260421T060153
CREATED:20230330T192235Z
LAST-MODIFIED:20230330T192235Z
UID:23974-1681394400-1681398000@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Final look at project report? 
URL:https://hdpusergroup.org/event/pcb-feature-min-36/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230413T200000Z
DTEND:20230413T210000Z
DTSTAMP:20260421T060153
CREATED:20230323T130347Z
LAST-MODIFIED:20230323T130347Z
UID:23946-1681398000-1681401600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss - Project Call
DESCRIPTION:Review Final report draft 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-project-call-7/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230414T140000Z
DTEND:20230414T150000Z
DTSTAMP:20260421T060153
CREATED:20230324T143056Z
LAST-MODIFIED:20230324T143056Z
UID:23958-1681462800-1681466400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-24/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230414T150000Z
DTEND:20230414T160000Z
DTSTAMP:20260421T060153
CREATED:20230405T035720Z
LAST-MODIFIED:20230405T035720Z
UID:23990-1681466400-1681470000@hdpusergroup.org
SUMMARY:Permittivity of Cooling Liquids
DESCRIPTION:Develop the idea stage of this project. 
URL:https://hdpusergroup.org/event/permittivity-of-cooling-liquids/
CATEGORIES:Permittivity of Cooling Liquids
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR