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CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
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TZOFFSETFROM:-0500
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DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230222T150000Z
DTEND:20230222T160000Z
DTSTAMP:20260421T085832
CREATED:20230125T155614Z
LAST-MODIFIED:20230125T155614Z
UID:23694-1677056400-1677060000@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-2/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230222T170000Z
DTEND:20230222T180000Z
DTSTAMP:20260421T085832
CREATED:20230201T171918Z
LAST-MODIFIED:20230201T171918Z
UID:23725-1677063600-1677067200@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Review latest peel strength\, SI and delamination/cycles to failure data 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-9/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230223T170000Z
DTEND:20230223T180000Z
DTSTAMP:20260421T085832
CREATED:20230210T040043Z
LAST-MODIFIED:20230210T040043Z
UID:23763-1677150000-1677153600@hdpusergroup.org
SUMMARY:Reduced Cost CAF
DESCRIPTION:CAF and ECM project 
URL:https://hdpusergroup.org/event/reduced-cost-caf-9/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20230223T190000Z
DTEND:20230223T200000Z
DTSTAMP:20260421T085832
CREATED:20230206T152410Z
LAST-MODIFIED:20230206T152410Z
UID:23672-1677157200-1677160800@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-21/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230223T210000Z
DTEND:20230223T220000Z
DTSTAMP:20260421T085832
CREATED:20230203T184923Z
LAST-MODIFIED:20230203T184923Z
UID:23733-1677164400-1677168000@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss
DESCRIPTION:Call to discuss test results \nFinal report assignments 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-5/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230224T150000Z
DTEND:20230224T160000Z
DTSTAMP:20260421T085832
CREATED:20230203T160117Z
LAST-MODIFIED:20230203T160117Z
UID:23732-1677229200-1677232800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-22/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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