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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
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DTSTART:20230312T080000
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TZOFFSETFROM:-0500
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DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230130T160000Z
DTEND:20230130T170000Z
DTSTAMP:20260421T085734
CREATED:20230109T165354Z
LAST-MODIFIED:20230109T165354Z
UID:23592-1675072800-1675076400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-16/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230201T170000Z
DTEND:20230201T180000Z
DTSTAMP:20260421T085734
CREATED:20230118T173758Z
LAST-MODIFIED:20230118T173758Z
UID:23668-1675249200-1675252800@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Review progress on peel strenghts\, IST\, microsections and SI 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-8/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230201T180000Z
DTEND:20230201T190000Z
DTSTAMP:20260421T085734
CREATED:20230112T201743Z
LAST-MODIFIED:20230112T201743Z
UID:23651-1675252800-1675256400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Work on members' meeting presentation \nSee if our design guys have anything to show 
URL:https://hdpusergroup.org/event/microvia-rel-26/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230201T200000Z
DTEND:20230201T210000Z
DTSTAMP:20260421T085734
CREATED:20230111T201242Z
LAST-MODIFIED:20230111T201242Z
UID:23641-1675260000-1675263600@hdpusergroup.org
SUMMARY:Photo Solder II
DESCRIPTION:Status on new boards \nStatus on x-sections \nFirst drop results \nMeeting presentation 
URL:https://hdpusergroup.org/event/photo-solder-ii-2/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230202T160000Z
DTEND:20230202T180000Z
DTSTAMP:20260421T085734
CREATED:20230119T173758Z
LAST-MODIFIED:20230119T173758Z
UID:23675-1675332000-1675339200@hdpusergroup.org
SUMMARY:Reduced cost CAF
DESCRIPTION:Reduced cost CAF 
URL:https://hdpusergroup.org/event/reduced-cost-caf-7/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230202T170000Z
DTEND:20230202T180000Z
DTSTAMP:20260421T085734
CREATED:20230113T213845Z
LAST-MODIFIED:20230113T213845Z
UID:23656-1675335600-1675339200@hdpusergroup.org
SUMMARY:Cu surface roughness model
DESCRIPTION:Present stack up for test vehicle. \nAnd resources moving forward. \ndevelop slides to move to implementation stage \n  
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-5/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230202T190000Z
DTEND:20230202T200000Z
DTSTAMP:20260421T085734
CREATED:20230119T192353Z
LAST-MODIFIED:20230119T192353Z
UID:23677-1675342800-1675346400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Complete Closeout presentation and work on Final Report 
URL:https://hdpusergroup.org/event/pcb-feature-min-31/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230202T210000Z
DTEND:20230202T220000Z
DTSTAMP:20260421T085734
CREATED:20230113T164240Z
LAST-MODIFIED:20230113T164240Z
UID:23655-1675350000-1675353600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss
DESCRIPTION:·       Discuss follow-on test to determine why Arsenic affects loss \n \n·       Discuss the final report
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-4/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230203T150000Z
DTEND:20230203T160000Z
DTSTAMP:20260421T085734
CREATED:20230113T153735Z
LAST-MODIFIED:20230113T153735Z
UID:23654-1675414800-1675418400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-21/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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