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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20230312T080000
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TZOFFSETFROM:-0500
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TZNAME:CST
DTSTART:20231105T070000
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BEGIN:VEVENT
DTSTART:20230117T160000Z
DTEND:20230117T170000Z
DTSTAMP:20260421T121845
CREATED:20221207T171215Z
LAST-MODIFIED:20221207T171215Z
UID:23503-1673949600-1673953200@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-3/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230118T170000Z
DTEND:20230118T180000Z
DTSTAMP:20260421T121845
CREATED:20221218T061904Z
LAST-MODIFIED:20221218T061904Z
UID:23525-1674039600-1674043200@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Deternining if peel strengths less that 4 lbs/inch will be reliable 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-7/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230118T180000Z
DTEND:20230118T190000Z
DTSTAMP:20260421T121845
CREATED:20221201T145251Z
LAST-MODIFIED:20221201T145251Z
UID:23475-1674043200-1674046800@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste -BGA leg project meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-project-meeting-2/2023-01-18/
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230119T140000Z
DTEND:20230119T150000Z
DTSTAMP:20260421T121845
CREATED:20230117T150334Z
LAST-MODIFIED:20230117T150334Z
UID:23661-1674115200-1674118800@hdpusergroup.org
SUMMARY:A meeting with NXTEC
DESCRIPTION:HDP Value & Technical Direction 
URL:https://hdpusergroup.org/event/a-meeting-with-nxtec/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230119T160000Z
DTEND:20230119T170000Z
DTSTAMP:20260421T121845
CREATED:20221208T162331Z
LAST-MODIFIED:20221208T162331Z
UID:23505-1674122400-1674126000@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-20/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230119T170000Z
DTEND:20230119T180000Z
DTSTAMP:20260421T121845
CREATED:20230109T173633Z
LAST-MODIFIED:20230109T173633Z
UID:23594-1674126000-1674129600@hdpusergroup.org
SUMMARY:Reduced Cost CAF
DESCRIPTION:Redduced Cost CAF 
URL:https://hdpusergroup.org/event/reduced-cost-caf-6/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20230119T190000Z
DTEND:20230119T200000Z
DTSTAMP:20260421T121845
CREATED:20230112T182719Z
LAST-MODIFIED:20230112T182719Z
UID:23650-1674133200-1674136800@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Writing report 
URL:https://hdpusergroup.org/event/pcb-feature-min-30/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR