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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
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TZOFFSETFROM:-0500
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TZNAME:CST
DTSTART:20221106T070000
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BEGIN:VEVENT
DTSTART:20221205T160000Z
DTEND:20221205T170000Z
DTSTAMP:20260421T121900
CREATED:20221115T150101Z
LAST-MODIFIED:20221115T150101Z
UID:23431-1670234400-1670238000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-20/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20221206T010000Z
DTEND:20221206T020000Z
DTSTAMP:20260421T121900
CREATED:20221117T015524Z
LAST-MODIFIED:20221117T015524Z
UID:23449-1670266800-1670270400@hdpusergroup.org
SUMMARY:Non-Contact CF Profile Project Call
DESCRIPTION:Non-Contact CF Profile Project Call 
URL:https://hdpusergroup.org/event/non-contact-cf-profile-project-call/
CATEGORIES:Non-Contact Copper Foil Profile
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221206T170000Z
DTEND:20221206T180000Z
DTSTAMP:20260421T121900
CREATED:20221206T150654Z
LAST-MODIFIED:20221206T150654Z
UID:23438-1670324400-1670328000@hdpusergroup.org
SUMMARY:innerlayer copper balancing telecom
DESCRIPTION:innerlayer copper balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-19/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221206T180000Z
DTEND:20221206T190000Z
DTSTAMP:20260421T121900
CREATED:20221128T143445Z
LAST-MODIFIED:20221128T143445Z
UID:23462-1670328000-1670331600@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations
DESCRIPTION:Harsh Use Alloy Evaluations project call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-2/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221206T203000Z
DTEND:20221206T213000Z
DTSTAMP:20260421T121900
CREATED:20221115T210554Z
LAST-MODIFIED:20221115T210554Z
UID:23439-1670337000-1670340600@hdpusergroup.org
SUMMARY:Website Redesign Team
DESCRIPTION:Website redesign team call to discuss feedback and pricing from website contractor. 
URL:https://hdpusergroup.org/event/website-redesign-team-3/
LOCATION:Virtual
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221207T150000Z
DTEND:20221207T160000Z
DTSTAMP:20260421T121900
CREATED:20221116T160610Z
LAST-MODIFIED:20221116T160610Z
UID:23441-1670403600-1670407200@hdpusergroup.org
SUMMARY:SIR Testing
DESCRIPTION:meeting 
URL:https://hdpusergroup.org/event/sir-testing-5/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221207T160000Z
DTEND:20221207T170000Z
DTSTAMP:20260421T121900
CREATED:20221109T165250Z
LAST-MODIFIED:20221109T165250Z
UID:23408-1670407200-1670410800@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-2/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221208T160000Z
DTEND:20221208T170000Z
DTSTAMP:20260421T121900
CREATED:20221027T172028Z
LAST-MODIFIED:20221027T172028Z
UID:23341-1670493600-1670497200@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-19/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221208T170000Z
DTEND:20221208T180000Z
DTSTAMP:20260421T121900
CREATED:20221117T195222Z
LAST-MODIFIED:20221117T195222Z
UID:23454-1670497200-1670500800@hdpusergroup.org
SUMMARY:TA Methods
DESCRIPTION:Update on testing 
URL:https://hdpusergroup.org/event/ta-methods-2/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20221208T200000Z
DTEND:20221208T210000Z
DTSTAMP:20260421T121900
CREATED:20221201T202427Z
LAST-MODIFIED:20221201T202427Z
UID:23483-1670508000-1670511600@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Do we have a Team Leader? 
URL:https://hdpusergroup.org/event/microvia-rel-23/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR