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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
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DTSTART:20220313T080000
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DTSTART:20221106T070000
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BEGIN:VEVENT
DTSTART:20220920T170000Z
DTEND:20220920T180000Z
DTSTAMP:20260421T214152
CREATED:20220907T182533Z
LAST-MODIFIED:20220907T182533Z
UID:23173-1663675200-1663678800@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model
DESCRIPTION:Various models proposed for predicting signal integrity. Huray model under consideration. 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-2/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220921T150000Z
DTEND:20220921T160000Z
DTSTAMP:20260421T214152
CREATED:20220831T161939Z
LAST-MODIFIED:20220831T161939Z
UID:23149-1663754400-1663758000@hdpusergroup.org
SUMMARY:ECM3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm3-meeting-2/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220921T160000Z
DTEND:20220921T170000Z
DTSTAMP:20260421T214152
CREATED:20220908T145151Z
LAST-MODIFIED:20220908T145151Z
UID:23174-1663758000-1663761600@hdpusergroup.org
SUMMARY:Backdrill Transition trlecom
DESCRIPTION:Backdrill Transition trlecom 
URL:https://hdpusergroup.org/event/backdrill-transition-trlecom/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220921T190000Z
DTEND:20220921T200000Z
DTSTAMP:20260421T214152
CREATED:20220921T180759Z
LAST-MODIFIED:20220921T180759Z
UID:23212-1663768800-1663772400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Meeting missing in system 
URL:https://hdpusergroup.org/event/microvia-rel-19/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220922T150000Z
DTEND:20220922T160000Z
DTSTAMP:20260421T214152
CREATED:20220901T160603Z
LAST-MODIFIED:20220901T160603Z
UID:23154-1663840800-1663844400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-7/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220922T160000Z
DTEND:20220922T170000Z
DTSTAMP:20260421T214152
CREATED:20220908T170445Z
LAST-MODIFIED:20220908T170445Z
UID:23176-1663844400-1663848000@hdpusergroup.org
SUMMARY:TA== Method
DESCRIPTION:Sample testing update 
URL:https://hdpusergroup.org/event/ta-method-6/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220922T180000Z
DTEND:20220922T190000Z
DTSTAMP:20260421T214152
CREATED:20220912T222104Z
LAST-MODIFIED:20220912T222104Z
UID:23181-1663851600-1663855200@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Update on project from Jim Fuller. 
URL:https://hdpusergroup.org/event/cu-peel-strength-2-3/
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220922T190000Z
DTEND:20220922T200000Z
DTSTAMP:20260421T214152
CREATED:20220913T020946Z
LAST-MODIFIED:20220913T020946Z
UID:23126-1663855200-1663858800@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss Call
DESCRIPTION:Call to discuss Cisco measurements and Final report.  \nMoved to 22nd for key person attendance. \n  
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-call-2/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220922T200000Z
DTEND:20220922T210000Z
DTSTAMP:20260421T214152
CREATED:20220908T171302Z
LAST-MODIFIED:20220908T171302Z
UID:22985-1663858800-1663862400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Paul is flying to Calumet to see what is the status. 
URL:https://hdpusergroup.org/event/pcb-feature-min-25/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220923T140000Z
DTEND:20220923T150000Z
DTSTAMP:20260421T214152
CREATED:20220902T150108Z
LAST-MODIFIED:20220902T150108Z
UID:23158-1663923600-1663927200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-17/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220923T170000Z
DTEND:20220923T180000Z
DTSTAMP:20260421T214152
CREATED:20220909T172727Z
LAST-MODIFIED:20220909T172727Z
UID:23179-1663934400-1663938000@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis Project
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-10/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR