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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
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BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
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BEGIN:VEVENT
DTSTART:20220829T160000Z
DTEND:20220829T170000Z
DTSTAMP:20260421T200252
CREATED:20220822T171909Z
LAST-MODIFIED:20220822T171909Z
UID:22993-1661770800-1661774400@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-18/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220830T170000Z
DTEND:20220830T180000Z
DTSTAMP:20260421T200252
CREATED:20220808T125309Z
LAST-MODIFIED:20220808T125309Z
UID:23019-1661860800-1661864400@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220831T130000Z
DTEND:20220831T140000Z
DTSTAMP:20260421T200252
CREATED:20220804T134921Z
LAST-MODIFIED:20220804T134921Z
UID:23017-1661932800-1661936400@hdpusergroup.org
SUMMARY:SIR Next Ev
DESCRIPTION:Last chance for getting participants for high voltage testing? \nIf no participants\, then move to Phase 2 (low voltage testing). 
URL:https://hdpusergroup.org/event/sir-next-ev-2/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220831T150000Z
DTEND:20220831T160000Z
DTSTAMP:20260421T200252
CREATED:20220818T163602Z
LAST-MODIFIED:20220818T163602Z
UID:23091-1661940000-1661943600@hdpusergroup.org
SUMMARY:Reduced Cost CAF telecom
DESCRIPTION:Reduced Cost CAF telecom 
URL:https://hdpusergroup.org/event/reduced-cost-caf-telecom-4/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220831T160000Z
DTEND:20220831T170000Z
DTSTAMP:20260421T200252
CREATED:20220817T140933Z
LAST-MODIFIED:20220817T140933Z
UID:23073-1661943600-1661947200@hdpusergroup.org
SUMMARY:ECM3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm3-meeting/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220901T140000Z
DTEND:20220901T150000Z
DTSTAMP:20260421T200252
CREATED:20220823T125313Z
LAST-MODIFIED:20220823T125313Z
UID:23104-1662022800-1662026400@hdpusergroup.org
SUMMARY:Better CAF EQ
DESCRIPTION:Updates from Jason and Hubert 
URL:https://hdpusergroup.org/event/better-caf-eq-21/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220901T150000Z
DTEND:20220901T160000Z
DTSTAMP:20260421T200252
CREATED:20220817T160030Z
LAST-MODIFIED:20220817T160030Z
UID:23075-1662026400-1662030000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-6/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220901T160000Z
DTEND:20220901T170000Z
DTSTAMP:20260421T200252
CREATED:20220811T170932Z
LAST-MODIFIED:20220811T170932Z
UID:23053-1662030000-1662033600@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:All samples should have complleted initial manufacture. \nAll samples requiring etching should have reached Jenny \nJenny and Sarah will have completed more testing 
URL:https://hdpusergroup.org/event/ta-method-4/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220901T190000Z
DTEND:20220901T200000Z
DTSTAMP:20260421T200252
CREATED:20220823T152407Z
LAST-MODIFIED:20220823T152407Z
UID:23106-1662040800-1662044400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Continue fleshing out project parameters 
URL:https://hdpusergroup.org/event/microvia-rel-16/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220902T140000Z
DTEND:20220902T150000Z
DTSTAMP:20260421T200252
CREATED:20220813T043117Z
LAST-MODIFIED:20220813T043117Z
UID:23018-1662109200-1662112800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-16/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220902T160000Z
DTEND:20220902T170000Z
DTSTAMP:20260421T200252
CREATED:20220811T233845Z
LAST-MODIFIED:20220811T233845Z
UID:23057-1662116400-1662120000@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Discuss whether or not to continue projet  
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-2/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR