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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
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DTSTART:20220313T080000
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TZOFFSETFROM:-0500
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DTSTART:20221106T070000
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BEGIN:VEVENT
DTSTART:20220711T150000Z
DTEND:20220711T160000Z
DTSTAMP:20260421T214032
CREATED:20220620T160032Z
LAST-MODIFIED:20220620T160032Z
UID:22797-1657533600-1657537200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-7/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220711T160000Z
DTEND:20220711T170000Z
DTSTAMP:20260421T214032
CREATED:20220628T114345Z
LAST-MODIFIED:20220628T114345Z
UID:22841-1657537200-1657540800@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing
DESCRIPTION:Innerlayer copper balancing 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-5/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220712T150000Z
DTEND:20220712T160000Z
DTSTAMP:20260421T214032
CREATED:20220630T122654Z
LAST-MODIFIED:20220630T122654Z
UID:22889-1657620000-1657623600@hdpusergroup.org
SUMMARY:Manage Backdrill Transition Kickoff
DESCRIPTION:Manage Backdrill Transition Kickoff 
URL:https://hdpusergroup.org/event/manage-backdrill-transition-kickoff/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220712T160000Z
DTEND:20220712T170000Z
DTSTAMP:20260421T214032
CREATED:20220705T122058Z
LAST-MODIFIED:20220705T122058Z
UID:22898-1657623600-1657627200@hdpusergroup.org
SUMMARY:Reduced Cost CAF telecom
DESCRIPTION:Reduced Cost CAF telecom 
URL:https://hdpusergroup.org/event/reduced-cost-caf-telecom/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220713T010000Z
DTEND:20220713T020000Z
DTSTAMP:20260421T214032
CREATED:20220624T074026Z
LAST-MODIFIED:20220624T074026Z
UID:22746-1657656000-1657659600@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-13/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220713T140000Z
DTEND:20220713T150000Z
DTSTAMP:20260421T214032
CREATED:20220622T150531Z
LAST-MODIFIED:20220622T150531Z
UID:22819-1657702800-1657706400@hdpusergroup.org
SUMMARY:SIR Testing the Next Evolution Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-the-next-evolution-meeting-8/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220713T170000Z
DTEND:20220713T180000Z
DTSTAMP:20260421T214032
CREATED:20220629T172935Z
LAST-MODIFIED:20220629T172935Z
UID:22842-1657713600-1657717200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste -BGA leg project meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-project-meeting/2022-07-13/
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T130000Z
DTEND:20220714T140000Z
DTSTAMP:20260421T214032
CREATED:20220630T133358Z
LAST-MODIFIED:20220630T133358Z
UID:22890-1657785600-1657789200@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:What can we do for drop testing \nThermocouple update \nBuild Update 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-18/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T140000Z
DTEND:20220714T150000Z
DTSTAMP:20260421T214032
CREATED:20220608T144843Z
LAST-MODIFIED:20220608T144843Z
UID:22747-1657789200-1657792800@hdpusergroup.org
SUMMARY:ECM 3 Project Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-project-meeting-5/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T160000Z
DTEND:20220714T170000Z
DTSTAMP:20260421T214032
CREATED:20220623T161549Z
LAST-MODIFIED:20220623T161549Z
UID:22827-1657796400-1657800000@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss Project Call
DESCRIPTION:Review Data Analysis \nDiscuss Final Report 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-project-call-3/
LOCATION:Virtual
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T190000Z
DTEND:20220714T200000Z
DTSTAMP:20260421T214032
CREATED:20220630T192324Z
LAST-MODIFIED:20220630T192324Z
UID:22893-1657807200-1657810800@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Review quotes \nFollow up on what Paul puts together out of previous minutes and what Kuldip proposed 
URL:https://hdpusergroup.org/event/microvia-rel-13/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220714T200000Z
DTEND:20220714T210000Z
DTSTAMP:20260421T214032
CREATED:20220630T200909Z
LAST-MODIFIED:20220630T200909Z
UID:22894-1657810800-1657814400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Calumet status 
URL:https://hdpusergroup.org/event/pcb-feature-min-23/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220715T170000Z
DTEND:20220715T180000Z
DTSTAMP:20260421T214032
CREATED:20220628T203659Z
LAST-MODIFIED:20220628T203659Z
UID:22874-1657886400-1657890000@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-call-5/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
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