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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20220313T080000
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DTSTART:20220601T020000Z
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DTSTAMP:20260421T200156
CREATED:20220520T062823Z
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UID:22448-1654030800-1654034400@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-40/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20220602T190000Z
DTEND:20220602T200000Z
DTSTAMP:20260421T200156
CREATED:20220505T182126Z
LAST-MODIFIED:20220505T182126Z
UID:22523-1654178400-1654182000@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model June 2 meeting
DESCRIPTION:Cu Surface Roughness Model meeting to discuss results of May Members Meeting and Kickoff meeting 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-june-2-meeting/
LOCATION:Virtual
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20220602T190000Z
DTEND:20220602T200000Z
DTSTAMP:20260421T200156
CREATED:20220525T004930Z
LAST-MODIFIED:20220525T004930Z
UID:22529-1654178400-1654182000@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Continue on Project Definition 
URL:https://hdpusergroup.org/event/microvia-rel-11/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20220602T200000Z
DTEND:20220602T210000Z
DTSTAMP:20260421T200156
CREATED:20220525T005032Z
LAST-MODIFIED:20220525T005032Z
UID:22527-1654182000-1654185600@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Status of build 
URL:https://hdpusergroup.org/event/pcb-feature-min-21/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20220603T140000Z
DTEND:20220603T150000Z
DTSTAMP:20260421T200156
CREATED:20220513T144544Z
LAST-MODIFIED:20220513T144544Z
UID:22572-1654246800-1654250400@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-13/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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