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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
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TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
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BEGIN:VEVENT
DTSTART:20220502T150000Z
DTEND:20220502T160000Z
DTSTAMP:20260422T010218
CREATED:20220418T161414Z
LAST-MODIFIED:20220418T161414Z
UID:22410-1651485600-1651489200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-4/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220503T150000Z
DTEND:20220503T160000Z
DTSTAMP:20260422T010218
CREATED:20220406T193332Z
LAST-MODIFIED:20220406T193332Z
UID:22375-1651572000-1651575600@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-33/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220503T160000Z
DTEND:20220503T170000Z
DTSTAMP:20260422T010218
CREATED:20220426T123953Z
LAST-MODIFIED:20220426T123953Z
UID:22446-1651575600-1651579200@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-3/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220504T150000Z
DTEND:20220504T160000Z
DTSTAMP:20260422T010218
CREATED:20220414T154939Z
LAST-MODIFIED:20220414T154939Z
UID:22393-1651658400-1651662000@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-18/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220505T020000Z
DTEND:20220505T030000Z
DTSTAMP:20260422T010218
CREATED:20220504T022534Z
LAST-MODIFIED:20220504T022534Z
UID:22469-1651698000-1651701600@hdpusergroup.org
SUMMARY:Grace Electron and HPD User Group Introductory Meeting
DESCRIPTION:Grace Electron and HPD User Group Introductory Meeting 
URL:https://hdpusergroup.org/event/grace-electron-and-hpd-user-group-introductory-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220505T140000Z
DTEND:20220505T150000Z
DTSTAMP:20260422T010218
CREATED:20220421T150817Z
LAST-MODIFIED:20220421T150817Z
UID:22427-1651741200-1651744800@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-11/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220505T170000Z
DTEND:20220505T180000Z
DTSTAMP:20260422T010218
CREATED:20220421T191013Z
LAST-MODIFIED:20220421T191013Z
UID:22428-1651752000-1651755600@hdpusergroup.org
SUMMARY:Cu Surface Roughness Model May 5th 2022 project meeting
DESCRIPTION:Cu Surface Roughness Model May 5th 2022 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-roughness-model-may-5th-2022-project-meeting/
LOCATION:Virtual
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220505T190000Z
DTEND:20220505T200000Z
DTSTAMP:20260422T010218
CREATED:20220425T173017Z
LAST-MODIFIED:20220425T173017Z
UID:22445-1651759200-1651762800@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:See if Paul has obtained a fabricator for the project 
URL:https://hdpusergroup.org/event/microvia-rel-10/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220505T200000Z
DTEND:20220505T210000Z
DTSTAMP:20260422T010218
CREATED:20220331T191632Z
LAST-MODIFIED:20220331T191632Z
UID:22336-1651762800-1651766400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Status of board build\, electrical test\, x-sections and maybe first CITC coupons 
URL:https://hdpusergroup.org/event/pcb-feature-min-20/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220506T000000Z
DTEND:20220506T010000Z
DTSTAMP:20260422T010218
CREATED:20220503T114651Z
LAST-MODIFIED:20220503T114651Z
UID:22471-1651777200-1651780800@hdpusergroup.org
SUMMARY:QFN for Auto Project Call
DESCRIPTION:Discuss final report 
URL:https://hdpusergroup.org/event/qfn-for-auto-project-call/
LOCATION:Virtual
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR