BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20210809T160000Z
DTEND:20210809T170000Z
DTSTAMP:20260423T070341
CREATED:20210803T125351Z
LAST-MODIFIED:20210803T125351Z
UID:20301-1628506800-1628510400@hdpusergroup.org
SUMMARY:Backdrill Under BGA
DESCRIPTION:Backdrill Under BGA 
URL:https://hdpusergroup.org/event/backdrill-under-bga-9/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210810T180000Z
DTEND:20210810T190000Z
DTSTAMP:20260423T070341
CREATED:20210629T184855Z
LAST-MODIFIED:20210629T184855Z
UID:20146-1628600400-1628604000@hdpusergroup.org
SUMMARY:Board thickness II
DESCRIPTION:Any results from Omar adding other variables to his models? 
URL:https://hdpusergroup.org/event/board-thickness-ii-21/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210810T190000Z
DTEND:20210810T200000Z
DTSTAMP:20260423T070341
CREATED:20210804T211602Z
LAST-MODIFIED:20210804T211602Z
UID:20306-1628604000-1628607600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:More work on defining the project 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-5/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210811T160000Z
DTEND:20210811T170000Z
DTSTAMP:20260423T070341
CREATED:20210810T194812Z
LAST-MODIFIED:20210810T194812Z
UID:20292-1628679600-1628683200@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Assessment Aug 11\, 2021 meeting
DESCRIPTION:Thermal Analysis Methodology Assessment Aug 11\, 2021 meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-assessment-aug-11-2021-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210811T170000Z
DTEND:20210811T180000Z
DTSTAMP:20260423T070341
CREATED:20210730T200740Z
LAST-MODIFIED:20210730T200740Z
UID:20289-1628683200-1628686800@hdpusergroup.org
SUMMARY:Low Ag Alloy Solder paste BGA leg project meeting of Aug 11\, 2021
DESCRIPTION:Low Ag Alloy Solder paste BGA leg project meeting of Aug 11\, 2021 
URL:https://hdpusergroup.org/event/low-ag-alloy-solder-paste-bga-leg-project-meeting-of-aug-11-2021/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210811T180000Z
DTEND:20210811T190000Z
DTSTAMP:20260423T070341
CREATED:20210715T223535Z
LAST-MODIFIED:20210715T223535Z
UID:20225-1628686800-1628690400@hdpusergroup.org
SUMMARY:Glass Type Comparison project meeting of Aug 11\, 2021
DESCRIPTION:Glass Type Comparison project meeting of Aug 11\, 2021 
URL:https://hdpusergroup.org/event/glass-type-comparison-project-meeting-of-aug-11-2021/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210813T140000Z
DTEND:20210813T150000Z
DTSTAMP:20260423T070341
CREATED:20210825T225518Z
LAST-MODIFIED:20210825T225518Z
UID:20226-1628845200-1628848800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-3/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR