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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
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TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
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BEGIN:VEVENT
DTSTART:20210712T150000Z
DTEND:20210712T160000Z
DTSTAMP:20260423T084343
CREATED:20210628T171938Z
LAST-MODIFIED:20210628T171938Z
UID:20135-1626084000-1626087600@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-21/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210713T150000Z
DTEND:20210713T160000Z
DTSTAMP:20260423T084343
CREATED:20210622T161654Z
LAST-MODIFIED:20210622T161654Z
UID:20117-1626170400-1626174000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-10/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210713T190000Z
DTEND:20210713T200000Z
DTSTAMP:20260423T084343
CREATED:20210629T201351Z
LAST-MODIFIED:20210629T201351Z
UID:20150-1626184800-1626188400@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Progress on materials to Calumet and status of design 
URL:https://hdpusergroup.org/event/pcb-feature-min-10/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210713T200000Z
DTEND:20210713T210000Z
DTSTAMP:20260423T084343
CREATED:20210624T202429Z
LAST-MODIFIED:20210624T202429Z
UID:20125-1626188400-1626192000@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:We are moving to Definition 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-4/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210714T130000Z
DTEND:20210714T140000Z
DTSTAMP:20260423T084343
CREATED:20210616T131348Z
LAST-MODIFIED:20210616T131348Z
UID:20085-1626249600-1626253200@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Hua to give summary of 2\, 3 & 4 via stacks on and off. \nStatus update on Intel backdrill samples. 
URL:https://hdpusergroup.org/event/disc2a-30/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210714T160000Z
DTEND:20210714T170000Z
DTSTAMP:20260423T084343
CREATED:20210701T210650Z
LAST-MODIFIED:20210701T210650Z
UID:20169-1626260400-1626264000@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Assessment July 14\, 2021 meeting
DESCRIPTION:Thermal Analysis Methodology Assessment July 14\, 2021 meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-assessment-july-14-2021-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210714T170000Z
DTEND:20210714T180000Z
DTSTAMP:20260423T084343
CREATED:20210701T210131Z
LAST-MODIFIED:20210701T210131Z
UID:20167-1626264000-1626267600@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste July 14\, 2021 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste July 14\, 2021 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-july-14-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210714T180000Z
DTEND:20210714T190000Z
DTSTAMP:20260423T084343
CREATED:20210621T165659Z
LAST-MODIFIED:20210621T165659Z
UID:20106-1626267600-1626271200@hdpusergroup.org
SUMMARY:Glass Type Composition July 14\, 2021 project meeting
DESCRIPTION:Glass Type Composition July 14\, 2021 project meeting 
URL:https://hdpusergroup.org/event/glass-type-composition-july-14-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210715T160000Z
DTEND:20210715T170000Z
DTSTAMP:20260423T084343
CREATED:20210701T203604Z
LAST-MODIFIED:20210701T203604Z
UID:20157-1626346800-1626350400@hdpusergroup.org
SUMMARY:Cu Foil Surface Treatment vs Loss July 15\, 2021 project meeting
DESCRIPTION:Cu Foil Surface Treatment vs Loss July 15\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-foil-surface-treatment-vs-loss-july-15-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210715T180000Z
DTEND:20210715T190000Z
DTSTAMP:20260423T084343
CREATED:20210701T204626Z
LAST-MODIFIED:20210701T204626Z
UID:20162-1626354000-1626357600@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 July 15\, 2021 project meeting
DESCRIPTION:Cu Peel Strength Phase 2 July 15\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-july-15-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210715T203000Z
DTEND:20210715T213000Z
DTSTAMP:20260423T084343
CREATED:20210715T145914Z
LAST-MODIFIED:20210715T145914Z
UID:20207-1626363000-1626366600@hdpusergroup.org
SUMMARY:Marketing Brainstorm session
DESCRIPTION:Call to discuss video and marketing 
URL:https://hdpusergroup.org/event/marketing-brainstorm-session/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210716T140000Z
DTEND:20210716T150000Z
DTSTAMP:20260423T084343
CREATED:20210825T225632Z
LAST-MODIFIED:20210825T225632Z
UID:20127-1626426000-1626429600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-2/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210716T150000Z
DTEND:20210716T160000Z
DTSTAMP:20260423T084343
CREATED:20210702T154522Z
LAST-MODIFIED:20210702T154522Z
UID:20173-1626429600-1626433200@hdpusergroup.org
SUMMARY:Technology direction telecom
DESCRIPTION:Technology direction telecom 
URL:https://hdpusergroup.org/event/technology-direction-telecom-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210716T160000Z
DTEND:20210716T170000Z
DTSTAMP:20260423T084343
CREATED:20210705T020909Z
LAST-MODIFIED:20210705T020909Z
UID:20177-1626433200-1626436800@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-24/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR