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X-WR-CALDESC:Events for HDP User Group
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TZOFFSETFROM:-0600
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DTSTART:20210314T080000
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DTSTART:20211107T070000
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BEGIN:VEVENT
DTSTART:20210601T150000Z
DTEND:20210601T160000Z
DTSTAMP:20260423T112829
CREATED:20210519T053049Z
LAST-MODIFIED:20210519T053049Z
UID:19880-1622541600-1622545200@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-19/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20210601T190000Z
DTEND:20210601T200000Z
DTSTAMP:20260423T112829
CREATED:20210525T143607Z
LAST-MODIFIED:20210525T143607Z
UID:19975-1622556000-1622559600@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Start of new project 
URL:https://hdpusergroup.org/event/photonic-soldering-ii/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20210601T200000Z
DTEND:20210601T210000Z
DTSTAMP:20260423T112829
CREATED:20210519T050927Z
LAST-MODIFIED:20210519T050927Z
UID:19783-1622559600-1622563200@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Next Steps \nPresentation for BoD and one for quarterly meeting 
URL:https://hdpusergroup.org/event/pcb-feature-min-8/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20210602T150000Z
DTEND:20210602T160000Z
DTSTAMP:20260423T112829
CREATED:20210525T101958Z
LAST-MODIFIED:20210525T101958Z
UID:19972-1622628000-1622631600@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA telecom 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-21/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210602T160000Z
DTEND:20210602T170000Z
DTSTAMP:20260423T112829
CREATED:20210512T175925Z
LAST-MODIFIED:20210512T175925Z
UID:19821-1622631600-1622635200@hdpusergroup.org
SUMMARY:Single Surface Finish for Soldered & Compression Contact Pads
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-for-soldered-compression-contact-pads-2/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210603T150000Z
DTEND:20210603T160000Z
DTSTAMP:20260423T112829
CREATED:20210524T155218Z
LAST-MODIFIED:20210524T155218Z
UID:19955-1622714400-1622718000@hdpusergroup.org
SUMMARY:ECM 2 project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-2-project-call-5/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210603T160000Z
DTEND:20210603T170000Z
DTSTAMP:20260423T112829
CREATED:20210521T192952Z
LAST-MODIFIED:20210521T192952Z
UID:19947-1622718000-1622721600@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss June 3\, 2021 meeting
DESCRIPTION:Cu Surface Treatment vs Loss June 3\, 2021 meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-june-3-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210603T170000Z
DTEND:20210603T180000Z
DTSTAMP:20260423T112829
CREATED:20210519T164239Z
LAST-MODIFIED:20210519T164239Z
UID:19924-1622721600-1622725200@hdpusergroup.org
SUMMARY:TA Analysis Eval Placeholder
DESCRIPTION:TA Analysis Eval Placeholder 
URL:https://hdpusergroup.org/event/ta-analysis-eval-placeholder/
CATEGORIES:Staff Calendar
END:VEVENT
BEGIN:VEVENT
DTSTART:20210603T170000Z
DTEND:20210603T180000Z
DTSTAMP:20260423T112829
CREATED:20210520T143906Z
LAST-MODIFIED:20210520T143906Z
UID:19941-1622721600-1622725200@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Eval June 3\, 2021 meeting
DESCRIPTION:Thermal Analysis Methodology Eval June 3\, 2021 meeting. \nNOTE we will be going back to Wednesdays at 11AM CST on June 16th 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-eval-june-3-2021-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20210603T180000Z
DTEND:20210603T190000Z
DTSTAMP:20260423T112829
CREATED:20210521T192624Z
LAST-MODIFIED:20210521T192624Z
UID:19946-1622725200-1622728800@hdpusergroup.org
SUMMARY:Cu Peel Strength June 3\, 2021 project meeting
DESCRIPTION:Cu Peel Strength June 3\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-june-3-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210604T140000Z
DTEND:20210604T150000Z
DTSTAMP:20260423T112829
CREATED:20210825T225642Z
LAST-MODIFIED:20210825T225642Z
UID:19789-1622797200-1622800800@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210604T170000Z
DTEND:20210604T180000Z
DTSTAMP:20260423T112829
CREATED:20210524T155431Z
LAST-MODIFIED:20210524T155431Z
UID:19956-1622808000-1622811600@hdpusergroup.org
SUMMARY:Technology Direction telecom
DESCRIPTION:Technology Direction telecom 
URL:https://hdpusergroup.org/event/technology-direction-telecom/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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