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X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
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DTSTART:20210314T080000
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TZOFFSETFROM:-0500
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DTSTART:20211107T070000
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BEGIN:VEVENT
DTSTART:20210503T150000Z
DTEND:20210503T160000Z
DTSTAMP:20260423T112854
CREATED:20210420T015632Z
LAST-MODIFIED:20210420T015632Z
UID:19679-1620036000-1620039600@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-19/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20210504T190000Z
DTEND:20210504T200000Z
DTSTAMP:20260423T112854
CREATED:20210419T204337Z
LAST-MODIFIED:20210419T204337Z
UID:19671-1620136800-1620140400@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:Dr Lu's progress \n<ore modellling \nX-ray & x-section data 
URL:https://hdpusergroup.org/event/board-thickness-ii-17/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20210504T200000Z
DTEND:20210504T210000Z
DTSTAMP:20260423T112854
CREATED:20210428T210649Z
LAST-MODIFIED:20210428T210649Z
UID:19750-1620140400-1620144000@hdpusergroup.org
SUMMARY:PCB Feature Min.
DESCRIPTION:Somacis \nInfo Kevin needs \n  
URL:https://hdpusergroup.org/event/pcb-feature-min-7/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20210505T150000Z
DTEND:20210505T160000Z
DTSTAMP:20260423T112854
CREATED:20210414T153753Z
LAST-MODIFIED:20210414T153753Z
UID:19626-1620208800-1620212400@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-3/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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BEGIN:VEVENT
DTSTART:20210505T160000Z
DTEND:20210505T170000Z
DTSTAMP:20260423T112854
CREATED:20210426T224244Z
LAST-MODIFIED:20210426T224244Z
UID:19714-1620212400-1620216000@hdpusergroup.org
SUMMARY:Thermal Analysis Methodology Evaluation May 5\, 2021 project meeting
DESCRIPTION:Thermal Analysis Methodology Evaluation May 5\, 2021 project meeting 
URL:https://hdpusergroup.org/event/thermal-analysis-methodology-evaluation-may-5-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210505T200000Z
DTEND:20210505T210000Z
DTSTAMP:20260423T112854
CREATED:20210428T201927Z
LAST-MODIFIED:20210428T201927Z
UID:19749-1620226800-1620230400@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Final Report \nScope of new project 
URL:https://hdpusergroup.org/event/photonic-soldering-30/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210506T140000Z
DTEND:20210506T150000Z
DTSTAMP:20260423T112854
CREATED:20210204T142536Z
LAST-MODIFIED:20210204T142536Z
UID:19200-1620291600-1620295200@hdpusergroup.org
SUMMARY:PFH Technology 2 Project Call
DESCRIPTION:PFH Technology 2 Project Call 
URL:https://hdpusergroup.org/event/pfh-technology-2-project-call/
CATEGORIES:PFH Technology 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210506T180000Z
DTEND:20210506T190000Z
DTSTAMP:20260423T112854
CREATED:20210426T191508Z
LAST-MODIFIED:20210426T191508Z
UID:19707-1620306000-1620309600@hdpusergroup.org
SUMMARY:HDP Cu Peel Strength P2 project May 6\, 2021 meeting
DESCRIPTION:HDP Cu Peel Strength P2 project May 6\, 2021 meeting 
URL:https://hdpusergroup.org/event/hdp-cu-peel-strength-p2-project-may-6-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210507T140000Z
DTEND:20210507T150000Z
DTSTAMP:20260423T112854
CREATED:20210423T083819Z
LAST-MODIFIED:20210423T083819Z
UID:19689-1620378000-1620381600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on Cycles To Failure At IST Project Meeting
DESCRIPTION:Effects of Plating Thickness on Cycles To Failure At IST Project Meeting 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-cycles-to-failure-at-ist-project-meeting/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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