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X-WR-CALDESC:Events for HDP User Group
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DTSTART:20210314T080000
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DTSTART:20211107T070000
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DTSTART:20210412T150000Z
DTEND:20210412T160000Z
DTSTAMP:20260423T142446
CREATED:20210330T124021Z
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UID:19506-1618221600-1618225200@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-16/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20210413T150000Z
DTEND:20210413T160000Z
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CREATED:20210331T210518Z
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UID:19518-1618308000-1618311600@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-5/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20210413T170000Z
DTEND:20210413T180000Z
DTSTAMP:20260423T142446
CREATED:20210316T172053Z
LAST-MODIFIED:20210316T172053Z
UID:19460-1618315200-1618318800@hdpusergroup.org
SUMMARY:Harsh Use Alloy Eval 2 Project Review
DESCRIPTION:Review project status
URL:https://hdpusergroup.org/event/harsh-use-alloy-eval-2-project-review/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20210413T190000Z
DTEND:20210413T200000Z
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CREATED:20210323T194046Z
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UID:19482-1618322400-1618326000@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Status on NDAs \nStatus on Design \nStatus of BoD presentation 
URL:https://hdpusergroup.org/event/pcb-feature-min-5/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20210413T200000Z
DTEND:20210413T210000Z
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CREATED:20210323T202305Z
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UID:19483-1618326000-1618329600@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Shadowing and splatter addtions to final report \nPhase 2 - Possible topics? 
URL:https://hdpusergroup.org/event/photonic-soldering-28/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20210414T150000Z
DTEND:20210414T160000Z
DTSTAMP:20260423T142446
CREATED:20210317T155625Z
LAST-MODIFIED:20210317T155625Z
UID:19467-1618394400-1618398000@hdpusergroup.org
SUMMARY:Materials #6 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-meeting-2/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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DTSTART:20210415T150000Z
DTEND:20210415T160000Z
DTSTAMP:20260423T142446
CREATED:20210401T160612Z
LAST-MODIFIED:20210401T160612Z
UID:19520-1618480800-1618484400@hdpusergroup.org
SUMMARY:ECM2 Project call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm2-project-call-25/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210415T180000Z
DTEND:20210415T190000Z
DTSTAMP:20260423T142446
CREATED:20210329T222942Z
LAST-MODIFIED:20210329T222942Z
UID:19501-1618491600-1618495200@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 April 15\, 2021 project meeting
DESCRIPTION:Cu Peel Strength Phase 2 April 15\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-april-15-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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