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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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X-PUBLISHED-TTL:PT1H
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
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TZOFFSETFROM:-0500
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TZNAME:CST
DTSTART:20211107T070000
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BEGIN:VEVENT
DTSTART:20210308T160000Z
DTEND:20210308T170000Z
DTSTAMP:20260423T155231
CREATED:20210302T010440Z
LAST-MODIFIED:20210302T010440Z
UID:19386-1615197600-1615201200@hdpusergroup.org
SUMMARY:Reliability and Power Cycles telecom
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-13/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210310T010000Z
DTEND:20210310T020000Z
DTSTAMP:20260423T155231
CREATED:20210224T022211Z
LAST-MODIFIED:20210224T022211Z
UID:19367-1615316400-1615320000@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-30/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210310T160000Z
DTEND:20210310T170000Z
DTSTAMP:20260423T155231
CREATED:20210301T210905Z
LAST-MODIFIED:20210301T210905Z
UID:19385-1615370400-1615374000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-4/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210310T180000Z
DTEND:20210310T190000Z
DTSTAMP:20260423T155231
CREATED:20210215T212428Z
LAST-MODIFIED:20210215T212428Z
UID:19273-1615377600-1615381200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste BGA Leg March 10\, 2021 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste BGA Leg March 10\, 2021 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-leg-march-10-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210311T020000Z
DTEND:20210311T030000Z
DTSTAMP:20260423T155231
CREATED:20210305T125346Z
LAST-MODIFIED:20210305T125346Z
UID:19400-1615406400-1615410000@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive Project Call
DESCRIPTION:Call to discuss testing with U.L. 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-project-call-12/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210311T170000Z
DTEND:20210311T180000Z
DTSTAMP:20260423T155231
CREATED:20210205T195517Z
LAST-MODIFIED:20210205T195517Z
UID:19220-1615460400-1615464000@hdpusergroup.org
SUMMARY:Cu Surface Treatment Vs Loss March 11\, 2021 project meeting
DESCRIPTION:Cu Surface Treatment Vs Loss March 11\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-march-11-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210311T190000Z
DTEND:20210311T200000Z
DTSTAMP:20260423T155231
CREATED:20210215T212125Z
LAST-MODIFIED:20210215T212125Z
UID:19272-1615467600-1615471200@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 March 11\, 2021 project meeting
DESCRIPTION:Cu Peel Strength Phase 2 March 11\, 2021 project meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-march-11-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR