BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20210215T160000Z
DTEND:20210215T170000Z
DTSTAMP:20260423T172734
CREATED:20210126T134002Z
LAST-MODIFIED:20210126T134002Z
UID:19157-1613383200-1613386800@hdpusergroup.org
SUMMARY:Reliability and Power Cycles Telecom
DESCRIPTION:Reliability and Power Cycles Telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-telecom-12/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210216T160000Z
DTEND:20210216T170000Z
DTSTAMP:20260423T172734
CREATED:20210202T163745Z
LAST-MODIFIED:20210202T163745Z
UID:19192-1613469600-1613473200@hdpusergroup.org
SUMMARY:Backdril Under BGA telecom
DESCRIPTION:Backdril Under BGA telecom 
URL:https://hdpusergroup.org/event/backdril-under-bga-telecom/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210216T180000Z
DTEND:20210216T190000Z
DTSTAMP:20260423T172734
CREATED:20210120T151658Z
LAST-MODIFIED:20210120T151658Z
UID:19127-1613476800-1613480400@hdpusergroup.org
SUMMARY:Harsh Use Alloy Eval 2 Call
DESCRIPTION:Call to discuss project updates 
URL:https://hdpusergroup.org/event/harsh-use-alloy-eval-2-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210216T210000Z
DTEND:20210216T220000Z
DTSTAMP:20260423T172734
CREATED:20210205T212600Z
LAST-MODIFIED:20210205T212600Z
UID:19223-1613487600-1613491200@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Quarterly presentation and Final report \nIntermetallic thickness \nOther solder pastes? 
URL:https://hdpusergroup.org/event/photonic-soldering-25/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210217T150000Z
DTEND:20210217T160000Z
DTSTAMP:20260423T172734
CREATED:20210212T163238Z
LAST-MODIFIED:20210212T163238Z
UID:19248-1613552400-1613556000@hdpusergroup.org
SUMMARY:Better CAF Equation
DESCRIPTION:Members' Meeting Presentation \nAnalysis of data \nNew steps? 
URL:https://hdpusergroup.org/event/better-caf-equation-14/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210217T160000Z
DTEND:20210217T170000Z
DTSTAMP:20260423T172734
CREATED:20210203T170426Z
LAST-MODIFIED:20210203T170426Z
UID:19195-1613556000-1613559600@hdpusergroup.org
SUMMARY:Materials #6 Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-6-call-16/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210218T010000Z
DTEND:20210218T020000Z
DTSTAMP:20260423T172734
CREATED:20210825T233344Z
LAST-MODIFIED:20210825T233344Z
UID:18193-1613588400-1613592000@hdpusergroup.org
SUMMARY:LVH Lifetime Predictor for TC Project Call
DESCRIPTION:LVH Lifetime Predictor for TC Project Call 
URL:https://hdpusergroup.org/event/lvh-lifetime-predictor-for-tc-project-call-4/
CATEGORIES:LVH Lifetime Predictor for TC
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210218T020000Z
DTEND:20210218T030000Z
DTSTAMP:20260423T172734
CREATED:20210215T143516Z
LAST-MODIFIED:20210215T143516Z
UID:19271-1613592000-1613595600@hdpusergroup.org
SUMMARY:Reliability of Wettable Flank in Routable QFN for Automotive - Project call
DESCRIPTION:Call to discuss ATC testing source and member meeting plans 
URL:https://hdpusergroup.org/event/reliability-of-wettable-flank-in-routable-qfn-for-automotive-project-call-11/
CATEGORIES:Reliability of Wettable Flank in Routable QFN for Automotive
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210218T160000Z
DTEND:20210218T170000Z
DTSTAMP:20260423T172734
CREATED:20210128T164113Z
LAST-MODIFIED:20210128T164113Z
UID:19171-1613642400-1613646000@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Inner Layer Copper Balancing Telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-3/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210218T170000Z
DTEND:20210218T180000Z
DTSTAMP:20260423T172734
CREATED:20210204T170131Z
LAST-MODIFIED:20210204T170131Z
UID:19204-1613646000-1613649600@hdpusergroup.org
SUMMARY:ECM2 Project call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm2-project-call-22/
CATEGORIES:Electro-Chemical Migration 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210218T193000Z
DTEND:20210218T203000Z
DTSTAMP:20260423T172734
CREATED:20210128T203830Z
LAST-MODIFIED:20210128T203830Z
UID:19173-1613655000-1613658600@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:Progress on: \nQFN samples to Dr Lu \nQFN materials properties \nQFN dimensions \nModelling of different board thicknesses and initial part work \n  
URL:https://hdpusergroup.org/event/board-thickness-ii-13/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR