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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
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TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
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DTSTART:20210314T080000
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DTSTART:20211107T070000
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BEGIN:VEVENT
DTSTART:20210208T160000Z
DTEND:20210208T170000Z
DTSTAMP:20260423T184341
CREATED:20210204T231147Z
LAST-MODIFIED:20210204T231147Z
UID:19207-1612778400-1612782000@hdpusergroup.org
SUMMARY:Damaged Materials Discussion
DESCRIPTION:Discussion 
URL:https://hdpusergroup.org/event/1000am-1100am-damaged-materials-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210209T200000Z
DTEND:20210209T210000Z
DTSTAMP:20260423T184341
CREATED:20210128T152904Z
LAST-MODIFIED:20210128T152904Z
UID:19169-1612879200-1612882800@hdpusergroup.org
SUMMARY:PCB Feature Miniaturization
DESCRIPTION:Status of contracts \n2.6.27 possible tester? \nDesign progress 
URL:https://hdpusergroup.org/event/pcb-feature-miniaturization-3/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210210T180000Z
DTEND:20210210T190000Z
DTSTAMP:20260423T184341
CREATED:20210120T193257Z
LAST-MODIFIED:20210120T193257Z
UID:19135-1612958400-1612962000@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste BGA Feb 10\, 2021 meeting
DESCRIPTION:Low Ag Alloy Solderpaste BGA Feb 10\, 2021 meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-bga-feb-10-2021-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210211T160000Z
DTEND:20210211T170000Z
DTSTAMP:20260423T184341
CREATED:20210121T160702Z
LAST-MODIFIED:20210121T160702Z
UID:19140-1613037600-1613041200@hdpusergroup.org
SUMMARY:DISC2A
DESCRIPTION:Status of negotiations with IMEC. \nThilo and Jason samples to Hua? \nIf so\, any results from Hua? 
URL:https://hdpusergroup.org/event/disc2a-21/
CATEGORIES:Digital Speckle Correlation (DSC) 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210211T190000Z
DTEND:20210211T200000Z
DTSTAMP:20260423T184341
CREATED:20210131T221244Z
LAST-MODIFIED:20210131T221244Z
UID:19178-1613048400-1613052000@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 Feb 11\, 2021 meeting
DESCRIPTION:\nContinue defining the project\n
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-feb-11-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210212T143000Z
DTEND:20210212T153000Z
DTSTAMP:20260423T184341
CREATED:20210206T164354Z
LAST-MODIFIED:20210206T164354Z
UID:19240-1613118600-1613122200@hdpusergroup.org
SUMMARY:NPL QFN Discussion
DESCRIPTION:Discuss update on NPL status 
URL:https://hdpusergroup.org/event/npl-qfn-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
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