BEGIN:VCALENDAR
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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
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METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20210314T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20211107T070000
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END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20210125T160000Z
DTEND:20210125T170000Z
DTSTAMP:20260423T184727
CREATED:20210119T135535Z
LAST-MODIFIED:20210119T135535Z
UID:19122-1611568800-1611572400@hdpusergroup.org
SUMMARY:Reliability and Power Cycles
DESCRIPTION:Reliability and Power Cycles telecom 
URL:https://hdpusergroup.org/event/reliability-and-power-cycles-4/
CATEGORIES:Reliability and Power Cycles
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210127T010000Z
DTEND:20210127T020000Z
DTSTAMP:20260423T184727
CREATED:20210106T015840Z
LAST-MODIFIED:20210106T015840Z
UID:18955-1611687600-1611691200@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-28/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210127T190000Z
DTEND:20210127T210000Z
DTSTAMP:20260423T184727
CREATED:20210120T200605Z
LAST-MODIFIED:20210120T200605Z
UID:19011-1611752400-1611759600@hdpusergroup.org
SUMMARY:HDP Board of Directors – Project Closure Review Call
DESCRIPTION:Agenda – \nCopper Peel Strength – John Davignon \nDesign Related Material Damage – Smitty \nMini-Power Cycles – Larry 
URL:https://hdpusergroup.org/event/hdp-board-of-directors-project-closure-review-call/
CATEGORIES:Board Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210127T190000Z
DTEND:20210128T000000Z
DTSTAMP:20260423T184727
CREATED:20210120T232814Z
LAST-MODIFIED:20210120T232814Z
UID:19137-1611752400-1611770400@hdpusergroup.org
SUMMARY:Board of Directors Project Close Call
DESCRIPTION:HDP Board of Directors - Project Closure Review Call\nWed\, Jan 27\, 2021 1:00 PM GMT-06:00\, Central (Chicago) Meeting number (access code): 1425540358Meeting password: pass123When it's time\, Join the meetingJoin by phone:1-650-479-3208 Call-in toll number (US/Canada) Access Code: 1425540358 
URL:https://hdpusergroup.org/event/board-of-directors-project-close-call/
CATEGORIES:Board Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T150000Z
DTEND:20210128T160000Z
DTSTAMP:20260423T184727
CREATED:20210112T205408Z
LAST-MODIFIED:20210112T205408Z
UID:19010-1611824400-1611828000@hdpusergroup.org
SUMMARY:PCB Feature Min
DESCRIPTION:Where we are wrt Implementation 
URL:https://hdpusergroup.org/event/pcb-feature-min-2/
CATEGORIES:PCB Feature Miniaturization
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T160000Z
DTEND:20210128T170000Z
DTSTAMP:20260423T184727
CREATED:20210112T141014Z
LAST-MODIFIED:20210112T141014Z
UID:18917-1611828000-1611831600@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-2/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T170000Z
DTEND:20210128T180000Z
DTSTAMP:20260423T184727
CREATED:20210120T191016Z
LAST-MODIFIED:20210120T191016Z
UID:19129-1611831600-1611835200@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss Jan 28\, 2021 meeting
DESCRIPTION:Cu Surface Treatment vs Loss Jan 28\, 2021 meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-jan-28-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T180000Z
DTEND:20210128T190000Z
DTSTAMP:20260423T184727
CREATED:20210113T194214Z
LAST-MODIFIED:20210113T194214Z
UID:19012-1611835200-1611838800@hdpusergroup.org
SUMMARY:Glass Type Comparison Jan 28\, 2021 project meeting
DESCRIPTION:Glass Type Comparison Jan 28\, 2021 project meeting. (NOTE: Off our regular schedule day and time due to BoD meeting on Jan 27th. 
URL:https://hdpusergroup.org/event/glass-type-comparison-jan-28-2021-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T190000Z
DTEND:20210128T200000Z
DTSTAMP:20260423T184727
CREATED:20210120T192708Z
LAST-MODIFIED:20210120T192708Z
UID:19132-1611838800-1611842400@hdpusergroup.org
SUMMARY:Cu Peel Strength Phase 2 Jan 28\, 2021 meeting
DESCRIPTION:Cu Peel Strength Phase 2 Jan 28\, 2021 meeting 
URL:https://hdpusergroup.org/event/cu-peel-strength-phase-2-jan-28-2021-meeting/
LOCATION:WebEx
CATEGORIES:Cu Peel Strength 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T200000Z
DTEND:20210128T210000Z
DTSTAMP:20260423T184727
CREATED:20210114T204550Z
LAST-MODIFIED:20210114T204550Z
UID:19026-1611842400-1611846000@hdpusergroup.org
SUMMARY:Board Thickness II
DESCRIPTION:Answers from BT Han and Hua Lu on what they would do for free - or not. \nOmar's initial investigation on modeling our 4 thicknesses of board and can he get CTE of a componet as an OUTPUT rather than needing it as a fundamental parameter input of his modedling program. 
URL:https://hdpusergroup.org/event/board-thickness-ii-12/
CATEGORIES:Board Thickness Effect on ATC Reliability II
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20210128T210000Z
DTEND:20210128T220000Z
DTSTAMP:20260423T184727
CREATED:20210121T221913Z
LAST-MODIFIED:20210121T221913Z
UID:19141-1611846000-1611849600@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Update on experimental work and paper 
URL:https://hdpusergroup.org/event/photonic-soldering-22/
CATEGORIES:Photonic Soldering
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR