BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20200308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20201101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20200623T150000Z
DTEND:20200623T160000Z
DTSTAMP:20260424T065036
CREATED:20200616T224007Z
LAST-MODIFIED:20200616T224007Z
UID:17552-1592906400-1592910000@hdpusergroup.org
SUMMARY:Backdrill Under BGA telecom
DESCRIPTION:Backdrill Under BGA 
URL:https://hdpusergroup.org/event/backdrill-under-bga-telecom-6/
CATEGORIES:Backdrill Under BGA
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200623T160000Z
DTEND:20200623T170000Z
DTSTAMP:20260424T065036
CREATED:20200617T183001Z
LAST-MODIFIED:20200617T183001Z
UID:17558-1592910000-1592913600@hdpusergroup.org
SUMMARY:Local Copper Density
DESCRIPTION:Local Copper Density 
URL:https://hdpusergroup.org/event/local-copper-density/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200624T150000Z
DTEND:20200624T160000Z
DTSTAMP:20260424T065036
CREATED:20200604T160436Z
LAST-MODIFIED:20200604T160436Z
UID:17494-1592992800-1592996400@hdpusergroup.org
SUMMARY:Materials #6 Call
DESCRIPTION:Meeting \n  
URL:https://hdpusergroup.org/event/materials-6-call-5/
CATEGORIES:Lead Free PWB Materials Reliability Phase 6
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200624T160000Z
DTEND:20200624T170000Z
DTSTAMP:20260424T065036
CREATED:20200618T194953Z
LAST-MODIFIED:20200618T194953Z
UID:17581-1592996400-1593000000@hdpusergroup.org
SUMMARY:Cu Surface Treatment June 24\, 2020 project meeting
DESCRIPTION:Cu Surface Treatment June 24\, 2020 project meeting 
URL:https://hdpusergroup.org/event/cu-surface-treatment-june-24-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200624T170000Z
DTEND:20200624T180000Z
DTSTAMP:20260424T065036
CREATED:20200618T195328Z
LAST-MODIFIED:20200618T195328Z
UID:17582-1593000000-1593003600@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste June 24\, 2020 project meeting
DESCRIPTION:Low Ag Alloy Solderpaste June 24\, 2020 project meeting 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-june-24-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Low Ag Alloy Solderpaste Reliability – BGA Leg
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200624T180000Z
DTEND:20200624T190000Z
DTSTAMP:20260424T065036
CREATED:20200602T184125Z
LAST-MODIFIED:20200602T184125Z
UID:17488-1593003600-1593007200@hdpusergroup.org
SUMMARY:Glass Type Comparison June 24\, 2020 project meeting
DESCRIPTION:Glass Type Comparison June 24\, 2020 project meeting 
URL:https://hdpusergroup.org/event/glass-type-comparison-june-24-2020-project-meeting/
LOCATION:WebEx
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200625T130000Z
DTEND:20200625T180000Z
DTSTAMP:20260424T065036
CREATED:20210825T135521Z
LAST-MODIFIED:20210825T135521Z
UID:17387-1593072000-1593090000@hdpusergroup.org
SUMMARY:HDP June 2020 Automotive Technology Webinar
DESCRIPTION:To download presentations click here – https://hdpusergroup.org/published-papers/ \nPlease use the registration button on this page\, or send an email to kima77@hdpug.org with the information below to register for June 25\, 2020\, at 8:00 AM US CST HDP sponsored Automotive Electronics Technology Webinar. \nRequired registration information: \nName – \nCompany –  \nEmail – \nOptional registration information: \nTitle – \nPhone- \n \nThis no-charge Webinar is open to the public and will be an opportunity to gain information on Automotive standards and technology. \nSpeakers will include: \nJan Vardaman – TechSearch International – Moderator \nDr. Stefan Gutschling – ZVEI – Mobility Trends and their Impact on the Automotive Supply Chain \nAlun Morgan – Ventec International – Power PCB requirements for Automotive Applications \nThorsten Meyer – Infineon – Automotive Packaging Trends – Challenges and Solutions \nArthur Creidler – U.L. – Regulatory landscape for vehicle electronics and primary evaluation tools for PCB reliability demands in the new e-mobility market. \nRaj Kumar – TTM Technologies – Considerations for Automotive PCB Manufacturing \nThere will be an opportunity for questions using the chat function of Webex. Questions will be collated during the session and speakers will address as many as time permits at the end of the talks.  \nAfter registration\, you will be sent a confirmation email with Webex logistics for the call and a few weeks before the call\, a calendar reminder for the call.  \n 
URL:https://hdpusergroup.org/event/hdp-june-2020-automotive-technology-webinar/2020-06-25/
CATEGORIES:Member Meetings
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200626T170000Z
DTEND:20200626T180000Z
DTSTAMP:20260424T065036
CREATED:20200608T202502Z
LAST-MODIFIED:20200608T202502Z
UID:17500-1593172800-1593176400@hdpusergroup.org
SUMMARY:Ultra Low Dk Glass Analysis
DESCRIPTION:Ultra Low Dk Glass Analysis 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-7/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20200626T170000Z
DTEND:20200626T180000Z
DTSTAMP:20260424T065036
CREATED:20200622T154844Z
LAST-MODIFIED:20200622T154844Z
UID:17589-1593172800-1593176400@hdpusergroup.org
SUMMARY:Ultra Low Dk Glass telecom
DESCRIPTION:Ultra Low Dk Glass 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-telecom-4/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR