BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20180311T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20181104T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20180205T150000Z
DTEND:20180205T160000Z
DTSTAMP:20260428T065147
CREATED:20190111T175308Z
LAST-MODIFIED:-00011130T055036Z
UID:11369-1517821200-1517824800@hdpusergroup.org
SUMMARY:DISC2
DESCRIPTION:
URL:https://hdpusergroup.org/event/disc2-6202/
CATEGORIES:Digital Image Speckle Correlation 2
END:VEVENT
BEGIN:VEVENT
DTSTART:20180205T163000Z
DTEND:20180205T170000Z
DTSTAMP:20260428T065147
CREATED:20190111T175317Z
LAST-MODIFIED:-00011130T055036Z
UID:11380-1517826600-1517828400@hdpusergroup.org
SUMMARY:Test with Marshall
DESCRIPTION:
URL:https://hdpusergroup.org/event/test-with-marshall-6222/
END:VEVENT
BEGIN:VEVENT
DTSTART:20180205T210000Z
DTEND:20180205T220000Z
DTSTAMP:20260428T065147
CREATED:20190111T175310Z
LAST-MODIFIED:-00011130T055036Z
UID:11371-1517842800-1517846400@hdpusergroup.org
SUMMARY:Board Thickness
DESCRIPTION:
URL:https://hdpusergroup.org/event/board-thickness-6207/
CATEGORIES:Board Thickness Effect on ATC Reliability
END:VEVENT
BEGIN:VEVENT
DTSTART:20180206T180000Z
DTEND:20180206T190000Z
DTSTAMP:20260428T065147
CREATED:20190111T175306Z
LAST-MODIFIED:-00011130T055036Z
UID:11367-1517918400-1517922000@hdpusergroup.org
SUMMARY:HUE Alloy Eval Project Call
DESCRIPTION:
URL:https://hdpusergroup.org/event/hue-alloy-eval-project-call-6198/
CATEGORIES:Harsh Use Environment Alloy Evaluation
END:VEVENT
BEGIN:VEVENT
DTSTART:20180207T133000Z
DTEND:20180207T143000Z
DTSTAMP:20260428T065147
CREATED:20190111T175312Z
LAST-MODIFIED:-00011130T055036Z
UID:11373-1517988600-1517992200@hdpusergroup.org
SUMMARY:Warpage Meeting
DESCRIPTION:
URL:https://hdpusergroup.org/event/warpage-meeting-6210/
CATEGORIES:FCBGA Package Warpage 2
END:VEVENT
BEGIN:VEVENT
DTSTART:20180207T150000Z
DTEND:20180207T160000Z
DTSTAMP:20260428T065147
CREATED:20190111T175244Z
LAST-MODIFIED:-00011130T055036Z
UID:11342-1517994000-1517997600@hdpusergroup.org
SUMMARY:Opto Phase 2
DESCRIPTION:
URL:https://hdpusergroup.org/event/opto-phase-2-6051/
CATEGORIES:Optoelectronics II
END:VEVENT
BEGIN:VEVENT
DTSTART:20180207T150000Z
DTEND:20180207T160000Z
DTSTAMP:20260428T065147
CREATED:20190111T175245Z
LAST-MODIFIED:-00011130T055036Z
UID:11343-1517994000-1517997600@hdpusergroup.org
SUMMARY:HDP Opto Phase 2
DESCRIPTION:
URL:https://hdpusergroup.org/event/hdp-opto-phase-2-6052/
CATEGORIES:Optoelectronics II
END:VEVENT
BEGIN:VEVENT
DTSTART:20180207T160000Z
DTEND:20180207T170000Z
DTSTAMP:20260428T065147
CREATED:20190111T175246Z
LAST-MODIFIED:-00011130T055036Z
UID:11344-1517997600-1518001200@hdpusergroup.org
SUMMARY:Lead Free PWB Materials Reliability Project Call
DESCRIPTION:
URL:https://hdpusergroup.org/event/lead-free-pwb-materials-reliability-project-call-6053/
CATEGORIES:Lead Free PWB Materials Reliability Phase 5
END:VEVENT
BEGIN:VEVENT
DTSTART:20180207T180000Z
DTEND:20180207T190000Z
DTSTAMP:20260428T065147
CREATED:20190111T175306Z
LAST-MODIFIED:-00011130T055036Z
UID:11366-1518004800-1518008400@hdpusergroup.org
SUMMARY:HDP Low Ag Alloy project meeting of Feb 7\, 2018
DESCRIPTION:Low Ag Alloy Solderpaste project meeting of Feb 7\, 2018 Agenda: Review Members Meeting presentation and proposal to start the BGA project 
URL:https://hdpusergroup.org/event/hdp-low-ag-alloy-project-meeting-of-feb-7-2018-6197/
CATEGORIES:Low Ag Alloy Solder Paste Reliability
END:VEVENT
BEGIN:VEVENT
DTSTART:20180208T150000Z
DTEND:20180208T160000Z
DTSTAMP:20260428T065147
CREATED:20190111T175253Z
LAST-MODIFIED:-00011130T055036Z
UID:11351-1518080400-1518084000@hdpusergroup.org
SUMMARY:Component Rework Reliability Project Call
DESCRIPTION:
URL:https://hdpusergroup.org/event/component-rework-reliability-project-call-6114/
CATEGORIES:Component Rework Reliability
END:VEVENT
BEGIN:VEVENT
DTSTART:20180208T160000Z
DTEND:20180208T170000Z
DTSTAMP:20260428T065147
CREATED:20190111T175253Z
LAST-MODIFIED:-00011130T055036Z
UID:11352-1518084000-1518087600@hdpusergroup.org
SUMMARY:Better CAF Acceleration Equation Project Call
DESCRIPTION:
URL:https://hdpusergroup.org/event/better-caf-acceleration-equation-project-call-6115/
CATEGORIES:Better CAF Acceleration Equation
END:VEVENT
BEGIN:VEVENT
DTSTART:20180208T170000Z
DTEND:20180208T180000Z
DTSTAMP:20260428T065147
CREATED:20190111T175305Z
LAST-MODIFIED:-00011130T055036Z
UID:11365-1518087600-1518091200@hdpusergroup.org
SUMMARY:High Frequency Loss due to Cu Topology Project Meeting Feb 8\, 2018
DESCRIPTION:HDP HIgh Frequency Loss due to CU Topology project meeting of Feb 8\, 2018 Agenda:  Review the roughness measurement data to date 
URL:https://hdpusergroup.org/event/high-frequency-loss-due-to-cu-topology-project-meeting-feb-8-2018-6196/
CATEGORIES:High Frequency Loss from Copper Topology
END:VEVENT
BEGIN:VEVENT
DTSTART:20180208T180000Z
DTEND:20180208T190000Z
DTSTAMP:20260428T065147
CREATED:20190111T175303Z
LAST-MODIFIED:-00011130T055036Z
UID:11363-1518091200-1518094800@hdpusergroup.org
SUMMARY:VeCS Project Meeting for Feb 8\, 2018
DESCRIPTION:Idea Phase Project Meeting for VeCS Technology Evaluation of Feb 8\, 2018 Agenda:  Continued discussion on VeCS Technology capabilities by Joan Tourne'- focus will be on design rules and routability. 
URL:https://hdpusergroup.org/event/vecs-project-meeting-for-feb-8-2018-6194/
CATEGORIES:VeCS Technology Evaluation
END:VEVENT
BEGIN:VEVENT
DTSTART:20180209T020000Z
DTEND:20180209T030000Z
DTSTAMP:20260428T065147
CREATED:20190111T175309Z
LAST-MODIFIED:-00011130T055036Z
UID:11370-1518120000-1518123600@hdpusergroup.org
SUMMARY:Solder Joint Reliability with Surface Finishes Project Meeting
DESCRIPTION:
URL:https://hdpusergroup.org/event/solder-joint-reliability-with-surface-finishes-project-meeting-6206/
CATEGORIES:Solder Joint Reliability with Surface Finishes
END:VEVENT
END:VCALENDAR