BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20170312T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20171105T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20170403T150000Z
DTEND:20170403T160000Z
DTSTAMP:20260428T235932
CREATED:20190111T174831Z
LAST-MODIFIED:-00011130T055036Z
UID:11036-1491213600-1491217200@hdpusergroup.org
SUMMARY:DISC2 Initial Project call
DESCRIPTION:
URL:https://hdpusergroup.org/event/disc2-initial-project-call-5097/
CATEGORIES:Digital Image Speckle Correlation 2
END:VEVENT
BEGIN:VEVENT
DTSTART:20170403T150000Z
DTEND:20170403T160000Z
DTSTAMP:20260428T235932
CREATED:20190111T174832Z
LAST-MODIFIED:-00011130T055036Z
UID:11037-1491213600-1491217200@hdpusergroup.org
SUMMARY:DISC2 Initial Project call
DESCRIPTION:
URL:https://hdpusergroup.org/event/disc2-initial-project-call-5098/
CATEGORIES:Digital Image Speckle Correlation 2
END:VEVENT
BEGIN:VEVENT
DTSTART:20170404T190000Z
DTEND:20170404T200000Z
DTSTAMP:20260428T235932
CREATED:20190111T174818Z
LAST-MODIFIED:-00011130T055036Z
UID:11019-1491314400-1491318000@hdpusergroup.org
SUMMARY:ECM 2 Project meeting
DESCRIPTION:
URL:https://hdpusergroup.org/event/ecm-2-project-meeting-4988/
CATEGORIES:Electro-Chemical Migration 2
END:VEVENT
BEGIN:VEVENT
DTSTART:20170405T150000Z
DTEND:20170405T160000Z
DTSTAMP:20260428T235932
CREATED:20190111T174827Z
LAST-MODIFIED:-00011130T055036Z
UID:11031-1491386400-1491390000@hdpusergroup.org
SUMMARY:HDP Military Laminate Evaluation
DESCRIPTION:
URL:https://hdpusergroup.org/event/hdp-military-laminate-evaluation-5082/
CATEGORIES:Harsh Environment Low-Halogen Reliability
END:VEVENT
BEGIN:VEVENT
DTSTART:20170405T170000Z
DTEND:20170405T180000Z
DTSTAMP:20260428T235932
CREATED:20190111T174820Z
LAST-MODIFIED:-00011130T055036Z
UID:11022-1491393600-1491397200@hdpusergroup.org
SUMMARY:Low Ag Alloy Solderpaste Phase 2 March 22 meeting
DESCRIPTION:  \nProject Meeting of April 5 \nAgenda: \nDiscuss ATC results \nDiscuss the FA guidelines that Helen Turner developed \n 
URL:https://hdpusergroup.org/event/low-ag-alloy-solderpaste-phase-2-march-22-meeting-5010/
CATEGORIES:Low Ag Alloy Solder Paste Reliability
END:VEVENT
BEGIN:VEVENT
DTSTART:20170406T140000Z
DTEND:20170406T150000Z
DTSTAMP:20260428T235932
CREATED:20190111T174827Z
LAST-MODIFIED:-00011130T055036Z
UID:11030-1491469200-1491472800@hdpusergroup.org
SUMMARY:LCA-2 Project call
DESCRIPTION:
URL:https://hdpusergroup.org/event/lca-2-project-call-5033/
CATEGORIES:PWB Environmental Life Cycle Analysis 2
END:VEVENT
BEGIN:VEVENT
DTSTART:20170406T150000Z
DTEND:20170406T160000Z
DTSTAMP:20260428T235932
CREATED:20190111T174822Z
LAST-MODIFIED:-00011130T055036Z
UID:11024-1491472800-1491476400@hdpusergroup.org
SUMMARY:SAC Aging 3 Project Call
DESCRIPTION:
URL:https://hdpusergroup.org/event/sac-aging-3-project-call-5015/
CATEGORIES:SAC Aging 3
END:VEVENT
BEGIN:VEVENT
DTSTART:20170406T160000Z
DTEND:20170406T170000Z
DTSTAMP:20260428T235932
CREATED:20190111T174828Z
LAST-MODIFIED:-00011130T055036Z
UID:11032-1491476400-1491480000@hdpusergroup.org
SUMMARY:High Frequency Loss from Copper Topology project meeting
DESCRIPTION:  \nThis is the follow on project to the Smooth CU Si project.  \n \nThe recently completed Smooth Cu Si project suggested a difference in the X versus Y axis topography of the drum side of the copper foil after some treatments could affect insertion loss. This project will delve into the question of how this copper directionality or topography can affect insertion loss and evaluate the level of this loss. The project team will evaluate foil directionality/topology\, differences in test method response to this directionality/topology and measure the difference in high frequency signal loss to foil directionality and surface treatments prior to lamination. \nThe new High Frequency Loss from Cu Topology website has been generated and this will be the last email from the old Smooth Cu Si site.  Sorry if you have received this twice as we change over to the new website. \n 
URL:https://hdpusergroup.org/event/high-frequency-loss-from-copper-topology-project-meeting-5083/
CATEGORIES:High Frequency Loss from Copper Topology
END:VEVENT
BEGIN:VEVENT
DTSTART:20170406T190000Z
DTEND:20170406T200000Z
DTSTAMP:20260428T235932
CREATED:20190111T174830Z
LAST-MODIFIED:-00011130T055036Z
UID:11035-1491487200-1491490800@hdpusergroup.org
SUMMARY:Mini Power Cycle Call
DESCRIPTION:
URL:https://hdpusergroup.org/event/mini-power-cycle-call-5093/
CATEGORIES:Mini Power Cycles,Mini Power Cycles One
END:VEVENT
BEGIN:VEVENT
DTSTART:20170406T200000Z
DTEND:20170406T210000Z
DTSTAMP:20260428T235932
CREATED:20190111T174837Z
LAST-MODIFIED:-00011130T055036Z
UID:11043-1491490800-1491494400@hdpusergroup.org
SUMMARY:RF Failure Detection
DESCRIPTION:
URL:https://hdpusergroup.org/event/rf-failure-detection-5177/
CATEGORIES:RF Failure Detection
END:VEVENT
END:VCALENDAR