Effects of Plating Thickness on CTF at IST Project Call
Cooling liquids are needed for certain electronic systems. what is not know is what liquids are more effective than others in terms of signal integrity and […]
The HDP June 2023 Asia Meeting will be held June 7 & 8, 2023 (Japan Time) / June 6 & 7 (US Time) in Omiya, Japan. […]
The HDP June 2023 Asia Meeting will be held June 7 & 8, 2023 (Japan Time) / June 6 & 7 (US Time) in Omiya, Japan. […]
The HDP June 2023 Asia Meeting will be held June 7 & 8, 2023 (Japan Time) / June 6 & 7 (US Time) in Omiya, Japan. […]
Determining reliability of materials based on peel strengths. And different copper foil types.
Effects of Plating Thickness on CTF as IST Phase 2 Project Call
In an immersion cooling system, infrastructure equipment can be submerged in a non-conductive cooling liqui Idea is to develop a model to predict permittivity of different […]