BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20260507T150000Z
DTEND:20260507T160000Z
DTSTAMP:20260507T120944
CREATED:20260427T161325Z
LAST-MODIFIED:20260427T161325Z
UID:40092-1778148000-1778151600@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project WebEx Meeting Call 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-16/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260507T210000Z
DTEND:20260507T220000Z
DTSTAMP:20260507T120944
CREATED:20260423T220009Z
LAST-MODIFIED:20260423T220009Z
UID:40081-1778169600-1778173200@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-35/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260512T150000Z
DTEND:20260512T160000Z
DTSTAMP:20260507T120944
CREATED:20260505T110754Z
LAST-MODIFIED:20260505T110754Z
UID:40119-1778580000-1778583600@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-14/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260513T030000Z
DTEND:20260513T040000Z
DTSTAMP:20260507T120944
CREATED:20260506T140936Z
LAST-MODIFIED:20260506T140936Z
UID:40126-1778623200-1778626800@hdpusergroup.org
SUMMARY:Call with BW Wanda Plus Grand Hotel on AV setup
DESCRIPTION:Call with BW Wanda Plus Grand Hotel on AV setup 
URL:https://hdpusergroup.org/event/call-with-bw-wanda-plus-grand-hotel-on-av-setup/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260513T140000Z
DTEND:20260513T150000Z
DTSTAMP:20260507T120944
CREATED:20260422T142430Z
LAST-MODIFIED:20260422T142430Z
UID:40044-1778662800-1778666400@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/ecm-4-22/
CATEGORIES:Electro-Chemical Migration 4
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260513T150000Z
DTEND:20260513T160000Z
DTSTAMP:20260507T120944
CREATED:20260429T153211Z
LAST-MODIFIED:20260429T153211Z
UID:40097-1778666400-1778670000@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-14/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260514T010000Z
DTEND:20260514T020000Z
DTSTAMP:20260507T120944
CREATED:20260427T003911Z
LAST-MODIFIED:20260427T003911Z
UID:39980-1778702400-1778706000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-35/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260514T150000Z
DTEND:20260514T160000Z
DTSTAMP:20260507T120944
CREATED:20260423T153415Z
LAST-MODIFIED:20260423T153415Z
UID:40063-1778752800-1778756400@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-6/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260514T160000Z
DTEND:20260514T170000Z
DTSTAMP:20260507T120944
CREATED:20260430T153754Z
LAST-MODIFIED:20260430T153754Z
UID:40098-1778756400-1778760000@hdpusergroup.org
SUMMARY:Thermal cooling methods-New Idea Discussion
DESCRIPTION:Discussion new idea project for Thermal Cooling Methods. \nNew Project Idea Call \n“Cooling Methods for Heat Dissipation” \nThere are significant challenges introduced by advanced packaging in terms of power delivery and thermal management.  \nNew thermal solutions (not including liquid cooling) for implementation with advanced substrates\, 3D Heterogeneous Integration and other design aspects\, are needed to reduce hotspots\, maintain thermal targets\, and enable long-term reliability in complex multilayer stacks. \nExpected solutions could include vertical heat extraction with TIM (Thermal Interface Materials)\, heat spreaders\, heat sinks and active and passive cooling of advanced package devices to allow the system to operate at higher power density levels. Consideration of any advanced materials including laminates is a possible solution.  \nPlease join us for a Project Idea Initiation call on May 14\, 2026 at 11:00 am Central time US. 
URL:https://hdpusergroup.org/event/thermal-cooling-methods-new-idea-discussion/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260514T180000Z
DTEND:20260514T190000Z
DTSTAMP:20260507T120944
CREATED:20260430T153913Z
LAST-MODIFIED:20260430T153913Z
UID:40103-1778763600-1778767200@hdpusergroup.org
SUMMARY:High aspect ratio through hole plating limits
DESCRIPTION:New Project Idea Call \n  \nHigh Aspect Ratio Through Hole Limits \nWith AI\, High Performance Computing\, Data Centers\, ADAS among other technologies\, layer counts are increasing. In addition\, aspect ratios of the plated through holes are becoming more challenging. It has long been recognized that copper plating thickness in the via as well as plating uniformity\, play a significant role in the overall long-term reliability of the via. As via diameters decrease and aspect ratios increase\, how much copper is required to ensure the long-term reliability of the vias? As aspect ratios increase\, fluid dynamics and chemical composition of the plating solution take on increased importance. What is the physical limitation of the PTH aspect ratio? Where does the reliability decrease? Can this be modeled?  Industry test methods such as IST and other accepted methods  can be employed to test to fail. \nThis new project idea call will take place on May 14\, 2026 at 1:00 pm Central Time U.S. Via Webex \nPlease join us for this important meeting. 
URL:https://hdpusergroup.org/event/high-aspect-ratio-through-hole-plating-limits/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260514T190000Z
DTEND:20260514T200000Z
DTSTAMP:20260507T120944
CREATED:20260416T194737Z
LAST-MODIFIED:20260416T194737Z
UID:40034-1778767200-1778770800@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-ups
DESCRIPTION:Look at last round of FA \nWork on final report 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-20/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260514T200000Z
DTEND:20260514T210000Z
DTSTAMP:20260507T120944
CREATED:20260430T204845Z
LAST-MODIFIED:20260430T204845Z
UID:40107-1778770800-1778774400@hdpusergroup.org
SUMMARY:Cu Outer Layer Trace Adhesion
DESCRIPTION:Review final report and DATA 
URL:https://hdpusergroup.org/event/cu-outer-layer-trace-adhesion/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260518T150000Z
DTEND:20260518T160000Z
DTSTAMP:20260507T120944
CREATED:20260504T160442Z
LAST-MODIFIED:20260504T160442Z
UID:40117-1779098400-1779102000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3
DESCRIPTION:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-6/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260519T190000Z
DTEND:20260519T200000Z
DTSTAMP:20260507T120944
CREATED:20260507T140756Z
LAST-MODIFIED:20260507T140756Z
UID:40129-1779199200-1779202800@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-2/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260521T140000Z
DTEND:20260521T150000Z
DTSTAMP:20260507T120944
CREATED:20260430T141743Z
LAST-MODIFIED:20260430T141743Z
UID:40101-1779354000-1779357600@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-20/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260521T150000Z
DTEND:20260521T160000Z
DTSTAMP:20260507T120944
CREATED:20260430T152111Z
LAST-MODIFIED:20260430T152111Z
UID:40102-1779357600-1779361200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Thin Dielectric Skew Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-8/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260521T160000Z
DTEND:20260521T170000Z
DTSTAMP:20260507T120944
CREATED:20260502T174759Z
LAST-MODIFIED:20260502T174759Z
UID:40114-1779361200-1779364800@hdpusergroup.org
SUMMARY:TCE Materials
DESCRIPTION:Review data received for Z and XY measurements. Discuss path forward. 
URL:https://hdpusergroup.org/event/tce-materials-5/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260527T150000Z
DTEND:20260527T160000Z
DTSTAMP:20260507T120944
CREATED:20260506T152732Z
LAST-MODIFIED:20260506T152732Z
UID:40127-1779876000-1779879600@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-46/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260528T140000Z
DTEND:20260528T150000Z
DTSTAMP:20260507T120944
CREATED:20260507T153339Z
LAST-MODIFIED:20260507T153339Z
UID:40130-1779958800-1779962400@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-17/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR